High-uniformity post-CMOS uncooled microbolometer focal plane array integrated with active matrix circuit

Abstract

This paper presents a high-uniformity post-CMOS fabricated uncooled microbolometer focal plane array (MFPA) integrated with an active matrix circuit. The active matrix circuit selects the row and column of MFPA, calibrates output offset and gain, and converts the resistance changes of MFPA to the output currents. The active matrix circuit with column-wise transistor-sharing scheme is proposed to improve the output non-uniformity. The output non-uniformity with proposed scheme is reduced to 26 %, compared to the conventional scheme.

The Micro Pirani Gauge with Low Noise CDS-CTIA for In-Situ Vacuum Monitoring

“…The width and length of the membrane-supporting leg are 1.5 μm and 21.5 μm, respectively. The sacrificial layer was removed using an O 2 plasma ashing process [9]. Unlike typical MEMS processes using wet cleaning and lift-off process, we applied a completely dry and fully CMOS-compatible materials and processes in order to eliminate the problems of degassing and temperature limitations.…”

“…Many researches have been reported to reduce the noise, chip size and power consumption [9,10]. Among them, the capacitive trans-impedance amplifier (CTIA) is the one of the most popular approaches due to its low power consumption and small size.…”

Electro-Thermal Modeling and Experimental Validation of Integrated Microbolometer with ROIC

“…The infrared (IR) image sensors based on uncooled microbolometer focal plane array (MFPA) have successfully been commercialized in many areas, including medicine, surveillance, mobile, military, night vision applications [1][2][3][4]. Microbolometer cells are resistive sensors that are sensitive to IR radiation.…”