2019
DOI: 10.1364/osac.2.003350
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Highly accurate positioned, rapid figure correction by reactive ion etching for large aperture lightweight membrane optical elements

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Cited by 5 publications
(4 citation statements)
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“…An Reactive Ion Figuring (RIF) process with a simple and universal masking method was demonstrated. Polyimide (PI) membrane substrates have been figure-corrected by RIF to the final figure error of 17~20 nm rms in total effective figuring time of several minutes 2 > REPLACE THIS LINE WITH YOUR MANUSCRIPT ID NUMBER (DOUBLE-CLICK HERE TO EDIT) < [16], [17]. This RIF process presents the advantages of a noncontact tool combined with high material removal rate and repeatability at nanometer level, which has been proved in semiconductor industry [18].…”
Section: Methodsmentioning
confidence: 99%
“…An Reactive Ion Figuring (RIF) process with a simple and universal masking method was demonstrated. Polyimide (PI) membrane substrates have been figure-corrected by RIF to the final figure error of 17~20 nm rms in total effective figuring time of several minutes 2 > REPLACE THIS LINE WITH YOUR MANUSCRIPT ID NUMBER (DOUBLE-CLICK HERE TO EDIT) < [16], [17]. This RIF process presents the advantages of a noncontact tool combined with high material removal rate and repeatability at nanometer level, which has been proved in semiconductor industry [18].…”
Section: Methodsmentioning
confidence: 99%
“…This is similar to the calculation and acquisition of dwell time in other polishing methods. In addition, unlike our previous attempts to perform reactive ion etching for fast figure-correction of transmission wave-front error on lightweight thin film diffraction elements and a quartz sub-mirror [ 25 , 30 ], an inkjet printer was used to print the UV-curable ink masking layers on the non-etching area MReg i ( x , y ) to protect the surface material. During each figuring cycle, when etching was completed, the masking layers were stripped using hydrogen peroxide, alcohol, and acetone, and the mirror was cleaned with deionized water.…”
Section: Theory and Mathematical Modelmentioning
confidence: 99%
“…In our previous research, we used this reactive ion etching technology with low temperature, high precision, and non-contact processing characteristics to process large-aperture ultra-light polyimide film substrate. A 400 mm aperture membrane substrate was figure-corrected by reactive ion etching from the initial figure error of 105 nm rms to the final figure error of ~17 nm rms [ 25 ]. This makes it possible to fabricate high-precision optical substrates of ultra-lightweight diffractive lenses.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the higher plasma temperature will cause damage to the membrane substrate, and the plasma jet method is clearly not suitable for etching PI films [ 16 ]. A rapid figure correction process for PI membrane optical elements by reactive ion etching has been proposed previously [ 17 ]. However, in the full aperture range, the etching rate distribution on the membrane surface is assumed to be the same in a single processing iteration.…”
Section: Introductionmentioning
confidence: 99%