Hydrogels
have emerged as promising materials for flexible electronics
due to their unique properties, such as high water content, softness,
and biocompatibility. In this perspective, we provide an overview
of the development of hydrogels for flexible electronics, with a focus
on three key aspects: mechanical properties, interfacial adhesion,
and conductivity. We discuss the principles of designing high-performance
hydrogels and present representative examples of their potential applications
in the field of flexible electronics for healthcare. Despite significant
progress, several challenges remain, including improving the antifatigue
capability, enhancing interfacial adhesion, and balancing water content
in wet environments. Additionally, we highlight the importance of
considering the hydrogel–cell interactions and the dynamic
properties of hydrogels in future research. Looking ahead, the future
of hydrogels in flexible electronics is promising, with exciting opportunities
on the horizon, but continued investment in research and development
is necessary to overcome the remaining challenges.