To achieve efficient and selective removal of Cu2+ from a multi‐ion coexistence environment, Cu2+‐imprinted SA/CMC/AM microspheres (IMSCA) were synthesized. The adsorption capacity and removal efficiency of the material under different preparation and adsorption conditions were investigated. The surface morphology and functional groups of IMSCA were characterized and analyzed using SEM, FTIR, and XRD. SEM images revealed a relatively smooth surface of IMSCA with specific pores and a relatively uniform structure. Special peaks appeared in FTIR spectrum of IMSCA, indicating the possibility of the imprinting process and the presence of imprinting sites. The semicrystalline structure exhibited by the imprinted microspheres in XRD characterization further reinforces the likelihood of imprinting sites. In terms of adsorption kinetics, the adsorption process followed a pseudo–second‐order kinetic model, suggesting that chemical adsorption was dominant during the IMSCA adsorption process. In terms of adsorption isotherms, the Langmuir model better fitted the experimental data, suggesting that the adsorption process was monolayer adsorption. The imprinted microspheres exhibited better selective adsorption in mixed solutions of multiple metal ions. After 10 adsorption–desorption cycles, the adsorption capacity of IMSCA remained at approximately 90%. Compared with other imprinted materials, IMSCA exhibits a higher adsorption capacity, a faster elution rate, and superior reusability.