2009
DOI: 10.1016/j.tsf.2008.10.126
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Highly efficient CIS solar cells and modules made by the co-evaporation process

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Cited by 90 publications
(44 citation statements)
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“…The absorbers of the latest record-efficiency solarcell devices based on Cu(InGa)Se 2 (CIGS) were prepared by three-or multi-stage evaporation processes [1,2]. This is at least in part attributed to the fact that this process gives rise to a spontaneous 'notch' grading of the gallium content GGI := [Ga]/[In + Ga] [3], for which Gabor et al offer a growth model [4].…”
Section: Introductionmentioning
confidence: 99%
“…The absorbers of the latest record-efficiency solarcell devices based on Cu(InGa)Se 2 (CIGS) were prepared by three-or multi-stage evaporation processes [1,2]. This is at least in part attributed to the fact that this process gives rise to a spontaneous 'notch' grading of the gallium content GGI := [Ga]/[In + Ga] [3], for which Gabor et al offer a growth model [4].…”
Section: Introductionmentioning
confidence: 99%
“…Keeping the [Cu]/([Ga]+[In]) ratio near stoichiometry at all times during the deposition makes it possible to tailor the [Ga]/([Ga]+[In]) ratio through the depth of the solar cell. In a direct comparison between a single-stage and a multistage process in the same evaporation system, the single-stage process led to lower efficiency [3]. In this paper, we show that efficiencies of up to 18.6% can be obtained with an inline deposition process, using a linear gradient with no notch and with a total active deposition time of 17.5 min using three metal sources and with a substrate Manuscript temperature of 520 • C. The baseline processes, as well as the substrates used, are standard processes that have been developed for reproducibility and robustness and not primarily for highest efficiencies.…”
mentioning
confidence: 99%
“…In order to achieve monolithic series interconnection of a module over a single substrate (thus achieving higher output voltage and significantly reduced series resistance losses), patterning of the bottom contact, absorber and front contact is often used. [115,116] Reducing the area of the inactive interconnection zones by higher definition patterning increases the useable module area. While the most popular chalcopyrite patterning method today is mechanical scribing, patterning by printing can reduce the number of processing steps.…”
Section: Direct Liquid-coating Techniques Suitable For Large-area Inmentioning
confidence: 99%