Highly integrated flexible electronic Circuits and Modules

Löher, Thomas; Seckel, Manuel; Pahl, B.; Böttcher, Lars; Ostmann, A.; Reichl, H.

doi:10.1109/impact.2008.4783814

Cited by 13 publications

(10 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Furthermore, according to a study by IDTechEx, the global demand for flexible hybrid electronics will reach a value of over $3 billion in 2030 [ 8 ]. Applications of flexible electronics include consumer electronics [ 9 , 10 ], industry technology [ 11 , 12 , 13 , 14 ], healthcare [ 15 , 16 , 17 ], automotive technology [ 4 , 18 ], and aerospace technology [ 18 , 19 ] ( Figure 1 ). These sectors drive the growth of the market for flexible electronics.…”

Section: Introductionmentioning

confidence: 99%

Bending Setups for Reliability Investigation of Flexible Electronics

et al. 2021

View full text Add to dashboard Cite

Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.

show abstract

Section: Introductionmentioning

confidence: 99%

Bending Setups for Reliability Investigation of Flexible Electronics

et al. 2021

View full text Add to dashboard Cite

show abstract

“…One is chip-on-film technology [1,2]. The other is chip-in-film technology [3][4][5][6]. The basic concept of flexible package system is shown in fig.1.…”

Section: Introductionmentioning

confidence: 99%

Flexible and ultra-thin embedded chip package

Kuo

Lee

et al. 2009

2009 59th Electronic Components and Technology Conference

View full text Add to dashboard Cite

An ultra-thin, flexible package was successfully demonstrated in this paper. The integration of semiconductor chip and flexible substrate, development of ultra-thin chip technology, and embedded chip technology are the key topics.For the purpose of bendable, the embedded chip should be thin enough. The chips were thinned to less than 20μm by mechanical grinding and plasma treatment process. Besides, the dicing before grinding (DBG) method was applied for segment of ultra-thin chips. The ultra-thin chip can be embedded into a thin polyimide material by lamination process and build-up layer coating without die attached film (DAF). Following, micro-via drilling process, metallization and patterning process realize electrical interconnections. A temporary rigid carrier substrate was used for handling ultrathin substrate during process. Finally, an ultra-thin, flexible package was accomplished by releasing from the carrier substrate. Using this novel process, the total thickness of flexible package is only 59μm. It can be easily bended, and the curvature radius of flexible package can reach 10mm without any cracks occurred. The static and dynamic bending tests were also done. The results show this ultra-thin and flexible package has good mechanical properties. Technologies and bending test results will be represented in this paper.

show abstract

“…For this reason, an alternate approach of fabricating devices first and thinning down the silicon substrate to achieve flexibility has recently been investigated. This methodology consists of polishing, grinding and thinning‐by‐dicing . However, these thinning techniques make use of abrasive processes that may damage the on chip devices while trying to achieve a few tens of microns in thickness to obtain good bendability further reducing the yield and hence eliminating one of the major advantages of silicon fabrication technologies, high cost/yield.…”

mentioning

confidence: 99%