Highly-Integrated Low-Power 60 GHz Multichannel Transceiver for Radar Applications in 28 nm CMOS

Issakov, Vadim; Ciocoveanu, Radu; Weigel, Robert; Geiselbrechtinger, Angelika; Rimmelspacher, J.

doi:10.1109/mwsym.2019.8700977

Cited by 19 publications

(4 citation statements)

References 6 publications

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“…1. A low-noise CMOS RX with a noise figure (NF) of 9 dB for radar applications has been presented in [9]. The proposed BIST system has been implemented in the same multi-channel radar IC with 3 TXs and 8 RXs [10].…”

Section: Introductionmentioning

confidence: 99%

Built-In Self-Test of Millimeter-Wave Integrated Front-End Circuits: How Far Have We Come?

Wenger,

Meinerzhagen,

Issakov

2024

IEEE Access

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With automotive radar and 5G/6G communications, mass-market applications for millimeterwave circuits in silicon technologies have been identified or established in recent years. For high-volume, millimeter-wave integrated circuits, operating roughly between 30 GHz and 300 GHz, testability is a major concern, both from an overall cost as well as a quality assurance perspective. A solution for cost effective, low-overhead test of millimeter-wave integrated circuits is the integration of built-in self-test (BIST) features into the high-frequency front-end. Because BIST is an emerging topic in high-frequency circuit design, the field is still very fragmented. A plethora of different system concepts as well as building blocks have been proposed in recent years. This paper tries to provide a comprehensive overview of the state of the art in millimeter-wave BIST in an attempt to drive the field towards identification of standardized self-test solutions.INDEX TERMS Built-in self-test, CMOS, millimeter-wave transceivers, SiGe, silicon.

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Section: Introductionmentioning

confidence: 99%

Built-In Self-Test of Millimeter-Wave Integrated Front-End Circuits: How Far Have We Come?

Wenger,

Meinerzhagen,

Issakov

2024

IEEE Access

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“…While the predicted adoption of millimeter-wave frequencies for 5G communications has not manifested yet, they remain a hot candidate for 6G applications [4], [5], [6]. Promising research results on radar and communications circuits at 60 [7], [8], [9], [10], [11], 120 [7], [12], [13], [14], and 140 GHz [15], [16], Fig. 1.…”

Section: Introductionmentioning

confidence: 99%

Differential-Mode Power Detection for Built-In Self-Test of SiGe Automotive Radar Transceiver Front Ends

Wenger,

Ng,

Korndörfer

et al. 2024

IEEE Trans. Microwave Theory Techn.

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Recently, the feasibility of differential-mode power detection for built-in self-test (BIST) in millimeter-wave SiGe transceiver front ends has been demonstrated. In this work, a system analysis of typical BIST scenarios is performed. Specifications for the input power levels as well as the accuracy of power detectors are derived from this analysis. A need for at least two different differential detector architectures is identified. Two detectors are derived from the differential power measurement concept, analyzed, and implemented in the 76-81-GHz automotive radar frequency band. They feature a low power consumption of 500 µW and, to the authors' best knowledge, the lowest published circuit areas of approximately 0.005 mm 2 while still being input matched to the differential 100 system impedance. Both these characteristics are essential to keep the overhead of the BIST minimal. With dynamic ranges of 30 dB and up to 46 dB for the two different architectures, the differential power detector concept can achieve sufficient performance for BIST applications. The robustness against process and temperature effects as well as noise is analyzed and reported for both detectors.

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“…The associate editor coordinating the review of this manuscript and approving it for publication was Wiren Becker . radio-frequency integrated circuits (RFICs) [2]- [5], for future mobile communication systems in 6G or 7G. For example, a measurement of the 60-GHz propagation characteristics inside bus was demonstrated [6].…”

Section: Introductionmentioning

confidence: 99%

Experimental Verification of Excavated Structure on Multi-Layered Substrates for Millimeter-Wave Signal Vertical Transition Using Copper Balls

Yoshida

Nishikawa

2020

IEEE Access

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This paper presents a vertical transition of millimeter-wave signal for interconnection between multi-layered substrates, which utilizes copper balls for vertical interconnection, as both for electrical connection and physical support. In particular, the copper balls were used to configure a quasi-coaxial transmission line at the vertical interconnection. The key idea was to create an excavated structure at the location of the copper balls to fix it, given that the copper balls slightly fluctuate during reflow soldering when simply placed on a flat surface. Such activity of the copper balls defines large variation in transmission characteristics at millimeter-wave band that produce low yield rate. Practically, with the proposed method of an excavated structure, the location error of the copper balls can be minimized, leading to high reproducibility in determining the copper balls location, and small variation of the transmission characteristics. To verify the method's effectiveness, a prototype having three vertically stacked multi-layered substrates with the excavated structure was fabricated. The excavation had a depth of 90 µm and diameter of 0.45 mm. The copper balls used had a 0.3-mm diameter. Five samples were fabricated and then evaluated by X-ray images and S-parameter measurements. Based on the results, the reflection characteristics of the measurement were less than −10 dB from dc to 97 GHz in the best-case scenario, whereas the variation in the S-parameters was comparatively small up to 70 GHz. Moreover, the X-ray images showed relatively small copper balls location error. These results indicate that the proposed excavated structure is effective for millimeter-wave vertical interconnections using copper balls, in small wireless terminal applications.

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Highly-Integrated Low-Power 60 GHz Multichannel Transceiver for Radar Applications in 28 nm CMOS

Cited by 19 publications

References 6 publications

Built-In Self-Test of Millimeter-Wave Integrated Front-End Circuits: How Far Have We Come?

Built-In Self-Test of Millimeter-Wave Integrated Front-End Circuits: How Far Have We Come?

Differential-Mode Power Detection for Built-In Self-Test of SiGe Automotive Radar Transceiver Front Ends

Experimental Verification of Excavated Structure on Multi-Layered Substrates for Millimeter-Wave Signal Vertical Transition Using Copper Balls

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