Highly miniaturized endoscopic spatial confocal point distance sensor

Prause, Korbinian; Thiele, Simon; Herkommer, Alois; Gießen, Harald; Pinzer, B; Layh, Michael

doi:10.1117/1.oe.59.3.035102

Cited by 4 publications

(3 citation statements)

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“…The use of 3D direct laser writing as a fast and highly accurate fabrication process for nano‐ and micro‐optical devices is widely used in different scientific fields such as biology, [ 1–3 ] microfluidics, [ 4–8 ] imaging, [ 9,10 ] optical communication, [ 11–13 ] beam shaping, [ 14–17 ] sensing, [ 18–25 ] trapping, [ 26,27 ] or endoscopy. [ 28–31 ] Furthermore, the complexity of 3D‐printed optics increased drastically over the years by utilizing new optical designs with multi‐lens objectives, [ 32–35 ] diffractive surfaces, [ 36 ] novel photoresists with different dispersion and their combination, [ 37,38 ] or even moving parts.…”

Section: Introductionmentioning

confidence: 99%

“…shaping, [14][15][16][17] sensing, [18][19][20][21][22][23][24][25] trapping, [26,27] or endoscopy. [28][29][30][31] Furthermore, the complexity of 3D-printed optics increased drastically over the years by utilizing new optical designs with multi-lens objectives, [32][33][34][35] diffractive surfaces, [36] novel photoresists with different dispersion and their combination, [37,38] or even moving parts.…”

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confidence: 99%

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3D Direct Laser Writing of Highly Absorptive Photoresist for Miniature Optical Apertures

Schmid

Toulouse

Thiele

et al. 2022

Adv Funct Materials

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The importance of 3D direct laser writing as an enabling technology increased rapidly in recent years. Complex micro‐optics and optical devices with various functionalities are now feasible. Different possibilities to increase the optical performance are demonstrated, for example, multi‐lens objectives, a combination of different photoresists, or diffractive optical elements. It is still challenging to create fitting apertures for these micro optics. In this work, a novel and simple way to create 3D‐printed opaque structures with a highly absorptive photoresist is introduced, which can be used to fabricate microscopic apertures increasing the contrast of 3D‐printed micro optics and enabling new optical designs. Both hybrid printing by combining clear and opaque resists, as well as printing transparent optical elements and their surrounding opaque apertures solely from a single black resist by using different printing thicknesses are demonstrated.

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Section: Introductionmentioning

confidence: 99%

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confidence: 99%

3D Direct Laser Writing of Highly Absorptive Photoresist for Miniature Optical Apertures

Schmid

Toulouse

Thiele

et al. 2022

Adv Funct Materials

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“…A confocal scanning based method is proposed to measure the narrow gap in line. The in-line measurement scheme for a gap is illustrated in Figure 1, which consists of a high precision movement mechanism, a confocal chromatic displacement sensor 12 and the fixture. The high precision movement mechanism is applied for counting the length between edges of the gap.…”

Section: Introductionmentioning

confidence: 99%

An edge identification method for gap in-line measurement based on fillet assumption

Zhao

Sun

Cao

et al. 2022

Measurement and Control

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The optical measurement technology could reduce manual work and improve quality in assembly. The confocal scanning scheme is proposed to measure the narrow gap in-line but it is hard to identify the edges of a gap. This paper proposed an edge definition and presented an edge identification method for gap measurement. The edge profile is defined as a part of a circle, which could be identified by the shutter time feature. The defined edge point could be calculated by fitting the edge profile, and then the width of a gap section is calculated by two edge points. The width of a gap can be evaluated by the average of several gap section. The experimental results indicate that the repeatability of the method is less than 2 µm and the precision of the measurement is higher than ±2.5 µm. The proposed method is feasible for in-line measurement application in assembly.

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