Highly Reliable Piezoelectric Process Technology in Volume Foundry for Emerging Mems Applications

Shih, Victor; Cheng, S. K.; Lin, You-Ru; Lin, Andy; Liao, Ying-Yu; Lin, Chun-Chu; Huang, Fuchun; Tai, Kelvin; Hu, Fangming; Tsai, Y. S.; Chen, Yen‐Wen; Chang, K. T.; Chiu, Chih‐Wei; Tsai, Leo; Teng, Vincent; Chen, Chih‐Ming; Yu, Terrence; Tu, Y. L.; Tseng, Lee-Chuan; Lee, Julian; Chen, Benior; Huang, Shih-Fen; Kalnitsky, Alexander

doi:10.1109/transducers.2019.8808685

Cited by 6 publications

(3 citation statements)

References 7 publications

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“…The fabrication process steps exploited to implement the multi-shape cantilever array in this work are illustrated in figure 5. In consideration of the reliability of PZT under the voltage applied, a passivation layer is adopted to avoid degradation of the PZT film due to ambient humidity [24,31]. First of all, 500 nm of thermal oxide was deposited on a silicon on insulator wafer with a 5 µm thick Si device layer.…”

Section: Fabrication and Resultsmentioning

confidence: 99%

“…In short, piezoelectric films are considered to be promising materials for MEMS microspeakers. Among the available piezoelectric films, PZT films feature a high piezoelectric coefficient and a stable deposition process which has also been commercialized [24]. Thus, this study will leverage the commercial fabrication processes to develop PZT-Si unimorph structures as MEMS microspeakers.…”

Section: Introductionmentioning

confidence: 99%

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On the design of a two-way piezoelectric MEMS microspeaker based on a multi-shape cantilever array for high-frequency applications

Chen¹,

Cheng²,

Cheng³

et al. 2023

J. Micromech. Microeng.

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This study presents the design and realization of a piezoelectric MEMS microspeaker for high-frequency enhancement. Based on piezoelectric thin film actuation, designs of cantilever diaphragms are conducted by modal analysis. Under a die size of 2.5 mm (w) × 5 mm (l) × 0.4 mm (t), the diaphragms are designed to include mid-range and tweeter units with regard to the balance of radiation area and sound pressure contribution. Furthermore, the out-of-phase driving of the proposed device can ensure that the superposition of the sound pressure level (SPL) is within the target frequency range (8–13 kHz) while reducing the SPL outside the target range. In pressure-field measurements, the proposed multi-shape cantilever array can produce high average SPL (91.6 dB) in the target frequency range from 8 kHz to 13 kHz and has a low total harmonic distortion (THD) of <1.4% under a 0.707 Vrms input signal. The performance can be further improved by biasing the input signal. With a 9 V bias, the average SPL of the proposed microspeaker in the target frequency range is enhanced to 99.4 dB, and the average THD is reduced to <0.7%. In addition, the THD from 7.7 kHz to 18 kHz is below 2.5%. This study shows the great potential of piezoelectric MEMS microspeakers for in-ear applications.

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Section: Fabrication and Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

On the design of a two-way piezoelectric MEMS microspeaker based on a multi-shape cantilever array for high-frequency applications

Chen¹,

Cheng²,

Cheng³

et al. 2023

J. Micromech. Microeng.

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show abstract

“…Our sensor utilizes electroplated Ni thick film, a standard CMOS-compatible material, as the magnetic field sensing media. In addition, the PZT used in our sensor is also a promising and reliable piezoelectric material adopted by standard CMOS/semiconductor and MEMS foundries [29]. Note that if considering the environmental friendliness issue of the PZT, another CMOS-compatible/environmentally friendly piezoelectric material, AlN, can be used as an alternative as well.…”

Section: Introductionmentioning

confidence: 99%

A Novel Three-Axial Magnetic-Piezoelectric MEMS AC Magnetic Field Sensor

2019

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We report a novel three-axial magnetic-piezoelectric microelectromechanical systems (MEMS) magnetic field sensor. The sensor mainly consists of two sensing elements. Each of the sensing elements consists of a magnetic Ni thick film, a Pt/Ti top electrode, a piezoelectric lead zirconate titanate (PZT) thin film, a Pt/Ti bottom electrode, a SiO2 insulation layer, and a moveable Si MEMS diaphragm. When the sensor is subjected to an AC magnetic field oscillating at 7.5 kHz, a magnetic force interaction between the magnetic field and Ni thick film is produced. Subsequently, the force deforms and deflects the diaphragms as well as the PZT thin film deposited on the diaphragms. The deformation and deflection produce corresponding voltage outputs due to the piezoelectric effect. By analyzing the voltage outputs through our criterion, we can obtain details of the unknown magnetic fields to which the sensor is subjected. This achieves sensing of three-axial magnetic fields. The experimental results show that the sensor is able to sense three-axial magnetic fields ranging from 1 to 20 Oe, with X-axial, Y-axial, and Z-axial sensitivities of 0.156 mVrms/Oe, 0.156 mVrms/Oe, and 0.035 mVrms/Oe, respectively, for sensing element A and 0.033 mVrms/Oe, 0.044 mVrms/Oe, and 0.130 mVrms/Oe, respectively, for sensing element B.

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Model order reduction for the analysis of large arrays of piezoelectric micromachined ultrasonic transducers in water

et al. 2021

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Highly Reliable Piezoelectric Process Technology in Volume Foundry for Emerging Mems Applications

Cited by 6 publications

References 7 publications

On the design of a two-way piezoelectric MEMS microspeaker based on a multi-shape cantilever array for high-frequency applications

On the design of a two-way piezoelectric MEMS microspeaker based on a multi-shape cantilever array for high-frequency applications

A Novel Three-Axial Magnetic-Piezoelectric MEMS AC Magnetic Field Sensor

Model order reduction for the analysis of large arrays of piezoelectric micromachined ultrasonic transducers in water

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