Highly Thermally Conductive Graphene-Based Thermal Interface Materials with a Bilayer Structure for Central Processing Unit Cooling

Abstract

Innovations of transistors toward miniaturization and integration aggravate heat accumulation of central processing units (CPUs). Thermal interface materials (TIMs) are critical to remove the generated heat and to guarantee the device reliability. Herein, maltose-assisted mechanochemical exfoliation was proposed to prepare maltose-g-graphene as a structural motif of TIMs. Then, maltose-g-graphene/gelatin composite films with a bilayer structure were prepared by two-step vacuum filtration to construct effective thermally conductive pathways consisting of the directionally arranged and tightly packed maltose-g-graphene. The bilayer composite film exhibited a remarkable in-plane thermal conductivity (30.8 W m −1 K −1 ) and strong anisotropic ratio (∼8325%) at 40 wt % maltose-g-graphene addition. More intriguingly, the cooling effect on CPUs was significantly better for the bilayer composite films than commercial thermal pads as TIMs. The outstanding thermally conductive stability in resistance to instantaneous and prolonged thermal shocks as well as fatigue stability was gathered. Our work offers a valuable reference to design and fabricate highperformance TIMs for CPU cooling to surmount harsh application scenarios.

Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

“…Most of prior works on graphene TIMs report the thermal conductivity values of the composites and, in some cases, temperature rise experiments with specific device structures [ 34 , 50 , 51 , 52 ]. The questions of the thermal contact resistance of graphene TIMs with the surfaces of interest and the effects of roughness on the TIM performance have not been properly addressed.…”

A dual non-covalent bonding constructed continuous interfacial structure for reducing interfacial thermal resistance

“…(e) Comparison of thermal conductivity of composites in our work with that of other reported composites containing functionalized graphene. [31][32][33][34][35][36][37][38][39] (f) Proposed mechanism of E-G@C-P3HT for thermal conduction. and S16 †).…”

Energy Relaxation and Cooling in Impure Bilayer Graphene at Low Temperatures

“…[3][4][5][6][7][8][9][10][11][12] Its significance springs from the fact that the thermal link between electrons and phonons in graphene is relatively weak, and this makes graphene an improved potential candidate for use in high-speed devices, [6] calorimetry, and bolometry. [1,2,9] For equilibration, the hot electrons begin to lose their energy through some cooling pathways of which the electronphonon (el-ph) interaction forms the principal channel of relaxation, as shown in Figure 1a. [5][6][7][8][9] The energy loss can occur through the emission of several types of phonons depending on the temperature range.…”