Highly thermally conductive PVDF-based ternary dielectric composites via engineering hybrid filler networks

Wang, Bin; Yin, Xiaohong; Peng, Donghong; Zhang, Yu; Wu, Wei; Gu, X. B.; Na, Bing; Lv, Ruihua; Liu, Hesheng

doi:10.1016/j.compositesb.2020.107978

Cited by 40 publications

(22 citation statements)

References 61 publications

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“…The obtained composite material has superior dielectric properties, and its thermal conductivity is twice that of pure PVDF [33]. In addition, Wang et al also used hexagonal silicon boron (hBN) nanosheets and functionalized silicon carbide (f-SiC) nanowires to prepare PVDF dielectric composites in the same way, and its thermal conductivity reaches 1.41 W m −1 K −1 [34]. In this work, Fishbone-like SiC fillers were added into PVDF to prepare a polymer composite by blending and hot-pressing.…”

Section: Introductionmentioning

confidence: 99%

Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide

et al. 2021

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The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m−1 K−1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.

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Section: Introductionmentioning

confidence: 99%

Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide

et al. 2021

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“…The newly synthesized LCERs would be expected to exhibit a melting point of about 180~250℃, and therefore can be suitable for the application in packing materials. Different kinds of boron nitride were chosen to add into the resins for studying the thermal conductivity of the composites [ 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 , 31 ].…”

Section: Introductionmentioning

confidence: 99%

Characteristic and Synthesis of High-Temperature Resistant Liquid Crystal Epoxy Resin Containing Boron Nitride Composite

Huang

Yeh

et al. 2022

Polymers

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Five liquid crystal epoxy resins and composites containing flat boron nitride (f-BN) and spherical boron nitride (s-BN) were successfully synthesized. The chemical structures, crystal diffraction, and thermal conductivity of the liquid crystal (LC) epoxy composites were measured using Nuclear Magnetic Resonance (NMR), Differential Scanning Calorimetry (DSC), X-ray, and Discovery Xenon Flash. In this study, the molecular arrangement of five LC epoxy resins and the thermal conductivity of their composites were carefully discussed. Several different amounts of flat boron nitride and spherical boron nitride were added to the five LC epoxy resins. The influence of nano-scale ceramic materials, f-BN, and s-BN, on the thermal conductivity of the LC epoxy resins, was studied. It is worth noting that the thermal conductivity of the spherical boron nitride composite demonstrated a better result than that of the flat boron nitride composite. In simpler terms, the thermal conductivity of the composites is closely related to the molecular arrangement of the LC resin and the amount of BN added. The results demonstrate that the SBPDAE/s-BN (60%) composite shows the highest thermal conductivity of 9.36 W/mK in the vertical direction. These data prove that the LC alignment of the matrix will greatly enhance the thermal conductivity of the composites.

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“…Commonly, the processing methods for preparing thermal conductive polymer composites include solution blending, chemical vapor deposition, induced orientation by an electric/magnetic field and hot pressing. Wang 14 prepared polyvinylidene fluoride(PVDF)/hexagonal boron nitride (h‐BN)/functional silicon carbide composites by ultrasonic dispersion in dimethylformamide (DMF) solution. When the BN content was 20 wt%, the thermal conductivity of the composite reached 1.40 W·m −1 ·K −1 .…”

Section: Introductionmentioning

confidence: 99%

High orientation structure in UHMWPE/BN composites continuously obtained by elongational flow field leading to superior thermal conductivity

Lin

Yin

et al. 2022

J of Applied Polymer Sci

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Ultra‐high‐molecular‐weight polyethylene/boron nitride (BN) composites have been continuously prepared successfully by eccentric rotor extruder (ERE) based on elongational flow. Optical microscopy (OM), scanning electron microscopy (SEM), x‐ray diffraction (XRD), thermal conductivity test, heat‐dissipation test, and tensile test were performed to investigate the orientation structure, thermal conductivity, mechanical properties, and insulation properties. The orientation factor and thermal conductivity of the composites prepared by ERE were 79.3 and 3.75 W·m−1·K−1, which were much higher than those of composites prepared with a torque mixer (14.7 and 2.73 W·m−1·K−1, respectively). OM and SEM showed that the BN sheets were in contact inside the composites and formed an efficient thermal conductivity network. Besides, the composites prepared by ERE had satisfactory mechanical and insulation properties (>1013 Ω·cm). This study provides experimental and theoretical guidance for industrial preparation of polymer/layered‐filler functional composites.

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Highly thermally conductive PVDF-based ternary dielectric composites via engineering hybrid filler networks

Cited by 40 publications

References 61 publications

Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide

Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide

Characteristic and Synthesis of High-Temperature Resistant Liquid Crystal Epoxy Resin Containing Boron Nitride Composite

High orientation structure in UHMWPE/BN composites continuously obtained by elongational flow field leading to superior thermal conductivity

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