2014
DOI: 10.1016/j.eurpolymj.2013.10.030
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Highly transparent and hydrophobic fluorinated polyimide films with ortho-kink structure

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Cited by 74 publications
(42 citation statements)
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“…The dispersive components of the surface free energy are near to those reported by other authors (ca. 30 mJ m −2 ) being in the range of 15.02–29.57 mJ m −2 . The increased values of the dispersive components of PA2 compared with PA1 accounts for an increased degree of molecular packing of the PA2 chains, which is more favored by the presence of less voluminous groups and quite flexible lateral phenoxy moieties.…”
Section: Resultsmentioning
confidence: 98%
“…The dispersive components of the surface free energy are near to those reported by other authors (ca. 30 mJ m −2 ) being in the range of 15.02–29.57 mJ m −2 . The increased values of the dispersive components of PA2 compared with PA1 accounts for an increased degree of molecular packing of the PA2 chains, which is more favored by the presence of less voluminous groups and quite flexible lateral phenoxy moieties.…”
Section: Resultsmentioning
confidence: 98%
“…However, the limitation of PI as an organic coating lies in the water absorption [2], which is a drawback for its use in coating for anticorrosion. The adoption of fluorine-containing monomers can enhance the hydrophobicity of PI [3] but superhydrophobicity cannot be simply achieved with monomer substitution since the surfaces have to be rough. The major limitation toward achieving superhydrophobicity of PI surfaces, however, lies in its flatness and poor workability after imidization.…”
Section: Introductionmentioning
confidence: 99%
“…Two new diamines with ortho ‐kink structure, 4‐bis[2‐amino‐4‐(trifluoromethyl)phenyl]piperazine (M1) and 1,4‐bis[2‐amino‐4‐(trifluoromethyl)phenoxy)]benzene (M2) were prepared by aromatic nucleophilic substitution reactions by Begunov and his coworkers ( Scheme ) . One‐step high‐temperature polycondensation of these diamines with fluorinated aromatic dianhydrides resulted in preparation of highly soluble PIs (soluble at room temperature even in THF) with excellent thermal stability, up to 345 °C, and high T g s in the range of 142–266 °C.…”
Section: Recent Design Approaches To Prepare Cpismentioning
confidence: 99%