History of semiconductors diffusion engineering

Lojek, Bo

doi:10.1109/rtp.2002.1039463

Cited by 7 publications

(6 citation statements)

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“…Thus, the standard explanation for oil firms' computing ventures is that they were "part of a diversification effort" (as Bo Lojek dismissively described Schlumberger's 1979 purchase of Fairchild). 100 Yet just because a business appears (especially retrospectively) unrelated to oil production does not mean that an oil company invested in it solely to diversify its portfolio. And even where diversification strategies were at work, we have to ask why oil companies diversified in some directions and not others.…”

Section: Spillovers Beyond Moneymentioning

confidence: 99%

Spillovers from Oil Firms to U.S. Computing and Semiconductor Manufacturing: Smudging State–Industry Distinctions and Retelling Conventional Narratives

Mody¹

2022

Enterp. Soc.

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Histories of semiconductor and computing technology in the United States have emphasized the supporting role of the U.S. state, especially the military, in answer to libertarian denials of state aid that are influential in Silicon Valley today. Somewhat implicit in that historiography, though, is the leading role of actors and organizations that blur any distinction between public and private. Some industries of this sort—telecommunications, aerospace, auto manufacturing—do figure in the historiography, but the class should be expanded further. One such industry—oil—has been exceptionally but almost invisibly influential in the development of computing and semiconductor manufacturing in the United States. Oil firms invested heavily in semiconductors and computing. There was also an “oil spillover” of personnel and technology from oil firms to computing and semiconductor manufacturing. Oil shows up in the biographies of many prominent individuals and organizations in the history of those technologies, from Fairchild Semiconductor to Edsger Dijkstra. These ties potentially hold important implications for the much-needed transition to a more sustainable energy regime.

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Section: Spillovers Beyond Moneymentioning

confidence: 99%

Spillovers from Oil Firms to U.S. Computing and Semiconductor Manufacturing: Smudging State–Industry Distinctions and Retelling Conventional Narratives

Mody¹

2022

Enterp. Soc.

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“…For many generations, it was possible to continue increasing device density by reducing processing temperatures that reduced diffusion; however, chemical doping needed to be replaced below features of 2 mm. Early in the development of semiconductor technology, ion implantation was identified as a potential method for doping and forming junctions [32,33]; however, it was not until later that ion implantation was used to introduce dopants into lightly doped regions of devices and eventually into the heavily doped regions of devices [34][35][36][37]. In many cases, the photoresist was used to block implantation of ions into undesired regions.…”

Section: (D) Dopant Processing Maskingmentioning

confidence: 99%

Lithography for enabling advances in integrated circuits and devices

Garner

2012

Phil. Trans. R. Soc. A.

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Because the transistor was fabricated in volume, lithography has enabled the increase in density of devices and integrated circuits. With the invention of the integrated circuit, lithography enabled the integration of higher densities of field-effect transistors through evolutionary applications of optical lithography. In 1994, the semiconductor industry determined that continuing the increase in density transistors was increasingly difficult and required coordinated development of lithography and process capabilities. It established the US National Technology Roadmap for Semiconductors and this was expanded in 1999 to the International Technology Roadmap for Semiconductors to align multiple industries to provide the complex capabilities to continue increasing the density of integrated circuits to nanometre scales. Since the 1960s, lithography has become increasingly complex with the evolution from contact printers, to steppers, pattern reduction technology at i-line, 248 nm and 193 nm wavelengths, which required dramatic improvements of mask-making technology, photolithography printing and alignment capabilities and photoresist capabilities. At the same time, pattern transfer has evolved from wet etching of features, to plasma etch and more complex etching capabilities to fabricate features that are currently 32 nm in high-volume production. To continue increasing the density of devices and interconnects, new pattern transfer technologies will be needed with options for the future including extreme ultraviolet lithography, imprint technology and directed self-assembly. While complementary metal oxide semiconductors will continue to be extended for many years, these advanced pattern transfer technologies may enable development of novel memory and logic technologies based on different physical phenomena in the future to enhance and extend information processing.

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“…The technique provided a controlled means to produce the necessary n-and p-type regions within semiconducting devices. Just two years later in 1957, Jay Lathrop and James Nall, both working at the U.S. Army's Diamond Ordnance Fuse Laboratories, successfully patterned metallic strips with a width of 200 µm as interconnects between Ge-based transistors [2]. Lathrop and Nall used the term "photolithography" to describe their process.…”

Section: Introductionmentioning

confidence: 99%

Harnessing Multi-Photon Absorption to Produce Three-Dimensional Magnetic Structures at the Nanoscale

et al. 2020

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Three-dimensional nanostructured magnetic materials have recently been the topic of intense interest since they provide access to a host of new physical phenomena. Examples include new spin textures that exhibit topological protection, magnetochiral effects and novel ultrafast magnetic phenomena such as the spin-Cherenkov effect. Two-photon lithography is a powerful methodology that is capable of realising 3D polymer nanostructures on the scale of 100 nm. Combining this with postprocessing and deposition methodologies allows 3D magnetic nanostructures of arbitrary geometry to be produced. In this article, the physics of two-photon lithography is first detailed, before reviewing the studies to date that have exploited this fabrication route. The article then moves on to consider how non-linear optical techniques and post-processing solutions can be used to realise structures with a feature size below 100 nm, before comparing two-photon lithography with other direct write methodologies and providing a discussion on future developments.

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History of semiconductors diffusion engineering

Cited by 7 publications

References 0 publications

Spillovers from Oil Firms to U.S. Computing and Semiconductor Manufacturing: Smudging State–Industry Distinctions and Retelling Conventional Narratives

Spillovers from Oil Firms to U.S. Computing and Semiconductor Manufacturing: Smudging State–Industry Distinctions and Retelling Conventional Narratives

Lithography for enabling advances in integrated circuits and devices

Harnessing Multi-Photon Absorption to Produce Three-Dimensional Magnetic Structures at the Nanoscale

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