2019
DOI: 10.3390/met10010058
|View full text |Cite
|
Sign up to set email alerts
|

History Reduction by Lumping for Time-Efficient Simulation of Additive Manufacturing

Abstract: Additive manufacturing is the process by which material is added layer by layer. In most cases, many layers are added, and the passes are lengthy relative to their thicknesses and widths. This makes finite element simulations of the process computationally demanding owing to the short time steps and large number of elements. The classical lumping approach in computational welding mechanics, popular in the 80s, is therefore, of renewed interest and is evaluated in this work. The method of lumping means that wel… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
18
0

Year Published

2020
2020
2021
2021

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 20 publications
(18 citation statements)
references
References 34 publications
0
18
0
Order By: Relevance
“…As discussed in Section 1 , lumped layer-by-layer material addition is considered here, which means that the uniform heat source is simultaneously applied over the entire volume of the newly deposited lumped layer. Both of these simplifications, i.e., lumping and layer-by-layer material addition, have been motivated and applied in number of previous LPBF simulation studies [ 23 , 24 , 25 , 26 , 33 ]. Apart from obvious computational benefits, these choices are motivated by the fact that it has been shown by Davies [ 24 ] that a model with these simplifications is adequate for correctly capturing the part-scale thermal response.…”
Section: Reference Thermal Lpbf Process Modelmentioning
confidence: 99%
See 2 more Smart Citations
“…As discussed in Section 1 , lumped layer-by-layer material addition is considered here, which means that the uniform heat source is simultaneously applied over the entire volume of the newly deposited lumped layer. Both of these simplifications, i.e., lumping and layer-by-layer material addition, have been motivated and applied in number of previous LPBF simulation studies [ 23 , 24 , 25 , 26 , 33 ]. Apart from obvious computational benefits, these choices are motivated by the fact that it has been shown by Davies [ 24 ] that a model with these simplifications is adequate for correctly capturing the part-scale thermal response.…”
Section: Reference Thermal Lpbf Process Modelmentioning
confidence: 99%
“…Moreover, the ILT for the real size layers also depends on multiple factors such as layer area, scanning pattern, number of parts printed together inside the same chamber and recoater speed. Therefore, as per the linear scaling suggested by Harrison [ 26 ] and Malmelöv et al [ 25 ], we choose to use an estimated value of 100 s which is 10 times the typical recoater time of 10 s and later we discuss the implications of this choice. The temperature-dependent properties of Ti-6Al-4V are taken from Davies [ 24 ] covering the range from room to fusion temperatures and shown in Figure 2 .…”
Section: Reference Thermal Lpbf Process Modelmentioning
confidence: 99%
See 1 more Smart Citation
“…The first approach assumes minimal time steps and a fine mesh of the part, which leads to fairly accurate temperature values, but the time spent on computations can be huge [ 22 , 23 ]. The second approach assumes a scheme according to which the material is added either in parts of a layer (a hatch-by-hatch), or in whole layers at once (layer-by-layer), or in several layers at once [ 21 , 24 ]. In this case, the deposited energy for a period of time corresponding to the trajectory traversed is distributed throughout the added material.…”
Section: Introductionmentioning
confidence: 99%
“…One of the most common methods for calculating transient temperature fields in the AM process is the finite element method (FEM) [ 22 , 23 ]. The material deposition in the DED process is often modeled using quiet or inactive elements, which are activated as the added filler material solidifies [ 24 , 25 ]. In the quiet approach, the elements are present in the calculations but are assigned special properties.…”
Section: Introductionmentioning
confidence: 99%