Hole-Injection Properties Characteristics of Fluorinated Self-Assembled Monolayer on Polymeric and Organic Light-Emitting Diodes

Abstract

We examine the electro-optic effects of a fluorinated self-assembled monolayer (FSAM) on polymeric light-emitting diodes (PLEDs) and organic light-emitting diodes (OLEDs). Owing to the high electronegativity of fluorine atoms, which decreases the hole-injection barrier-height, the LEDs with FSAM as the hole-injection layer (HIL) have the highest current density. The current densities of the LEDs with FSAM, poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS), and without HIL were estimated to be approximately 1, 0.24, and 0.06 A/cm2 respectively at 10 V. During the operational lifetime of the PLEDs, the driving voltage with FSAM is suppressed owing to the ohmic contact of the FSAM-modified ITO.

Azide‐substituted Poly(N‐ethyl‐3‐vinylcarbazole) as a Thermally Cross‐Linkable Hole‐Transporting Material for Polymeric Light‐Emitting Diodes

“…Polymers P1-P6, as shown in Scheme 1, were synthesized by radical copolymerization of monomers 1 and 2, respectively, with various feeding mole ratios of 0:100 (P1), 5:95 (P2), 10:90 (P3), 15:85 (P4), 20:80 (P5), and 100:0 (P6) in N-methylpyrolidine (NMP), using azobisisobutyronitrile (AIBN) as a radical initiator. Their compositions were substantially characterized by 1 H NMR spectroscopy.…”

“…Electroluminescence has attracted much attention due to their great potential in large‐area flat‐panel displays or luminescent devices . Polymeric light‐emitting diodes (PLEDs) have attracted the interest of researchers because they can be easily fabricated through layer‐by‐layer spin‐coating or dip‐coating techniques . However, swelling or redissolution of the precoated layers from substrate during the multistep coating process may cause the destruction of the device structures.…”

“…[1][2][3][4][5][6][7][8][9][10][11] Polymeric lightemitting diodes (PLEDs) have attracted the interest of researchers because they can be easily fabricated through layer-by-layer spin-coating or dip-coating techniques. [12][13][14][15][16][17][18][19][20][21] However, swelling or redissolution of the precoated layers from substrate during the multistep coating process may cause the destruction of the device structures. Therefore, various methods such as electrochemical, thermal, or photochemical crosslinking have been developed to cure the precoated layers against solvent etching during device fabrication.…”