2015
DOI: 10.1016/j.orgel.2015.07.028
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Hole transporting material-free and annealing-free thermal evaporated planar perovskite solar cells with an ultra-thin CH3NH3PbI3−Cl layer

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Cited by 15 publications
(17 citation statements)
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“…This means that this interface can be applied to fabricate device with anode/perovskite/ETL/cathode structure, where the interface between perovskite and ITO determines hole extraction. This is consistent with the reported devices, where HTL‐free PSCs with 0.8–1.0 V of V oc and 5–15% of PCE were obtained.…”
Section: Ela For Specific Interfacessupporting
confidence: 93%
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“…This means that this interface can be applied to fabricate device with anode/perovskite/ETL/cathode structure, where the interface between perovskite and ITO determines hole extraction. This is consistent with the reported devices, where HTL‐free PSCs with 0.8–1.0 V of V oc and 5–15% of PCE were obtained.…”
Section: Ela For Specific Interfacessupporting
confidence: 93%
“…Considering that the use of extra materials brings the complexity of fabrication process and increases the cost of PSCs, HTL‐free or ETL‐free PSCs with 5–15% PCE (as listed in Tables 2 and 3 ) have been demonstrated . For HTL‐free PSCs, the perovskite layer is usually covered by Au electrode or the perovskite film is directly deposited on ITO electrode.…”
Section: Ela For Specific Interfacesmentioning
confidence: 99%
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“…The PCE dropped to~3.72% from the initial value of~6.21%. A similar report on HTM free PSCs [334] showed a drop in PCE, FF and J SC (Fig. 23b); however, the V OC showed a slight increase.…”
Section: Stability Of Htm Free and Monolithic Perovskite Solar Cellssupporting
confidence: 83%
“…23. (a) Long-term stability performance of various HTM-free PSCs stored in air at room temperature without encapsulation [333], (b) photovoltaic parameters as a function of aging time for the device with a 35 nm CH 3 NH 3 PbI 3 x Cl x [334], (c) stability test of unencapsulated PSCs employing PEDOT;PSS and CuO x as HTM performed in air [232], and (d) stability of the device subjected to light soaking at room temperature without encapsulation [335]. Figures are reproduced with permission from the references.…”
Section: Discussionmentioning
confidence: 99%