Hole-type two-dimensional photonic crystal fabricated in silicon on insulator wafers

Teo, S.H.G.; Liu, A.Q.; Singh, Jasveer; Yu, Mingbin

doi:10.1016/j.sna.2006.06.030

Cited by 7 publications

(5 citation statements)

References 32 publications

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“…A phenomenon usually occurring in DRIE-the aspect ratio dependent etching (ARDE) [18,19]-was used to build the notches into the bug-type sacrificial bridges. The etching depth depends on the width of the trench opening.…”

Section: Processing and Resultsmentioning

confidence: 99%

Sacrificial bridges for MEMS fabrication

Chang

Chen

Fong

et al. 2011

J. Micromech. Microeng.

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This study discusses sacrificial bridges that are used to release MEMS devices. Before being released, sacrificial bridges connect all the component structures into an integral structure. Solder bump bonding is used to mount the MEMS chip on another chip or a printed circuit board (PCB) and to maintain the alignment among all component structures after removal of the sacrificial bridges. Two types of sacrificial bridges were designed, analyzed and fabricated. The fabrication process—which used low resistivity single crystal silicon (SCS) wafers as the device material—was developed to implement the sacrificial bridges. Novel SCS through silicon vias (TSVs), which interconnect stacked chips, was made using the same process. An electrostatic comb drive actuator was fabricated and mounted onto a PCB. The fabricated actuator was tested to demonstrate the feasibility of the fabrication process, sacrificial bridges and SCS TSVs. The results show that the actuator worked well. Its maximum displacement and resonant frequency were 69.9 µm and 406 Hz, respectively. This method is promising for the delivery of a novel 3D system in package for MEMS devices.

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Section: Processing and Resultsmentioning

confidence: 99%

Sacrificial bridges for MEMS fabrication

Chang

Chen

Fong

et al. 2011

J. Micromech. Microeng.

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“…Then, the PR is deposited on the substrate to define the pattern of the metal structures. Finally, the metal film is etched using different technologies, such as DRIE [104,105], electron beam lithography [106] etc.…”

Section: Surface Micromachining Technologymentioning

confidence: 99%

Micromachined tunable metamaterials: a review

Liu¹,

Zhu²,

Tsai³

et al. 2012

J. Opt.

156

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This paper reviews micromachined tunable metamaterials, whereby the tuning capabilities are based on the mechanical reconfiguration of the lattice and/or the metamaterial element geometry. The primary focus of this review is the feasibility of the realization of micromachined tunable metamaterials via structure reconfiguration and the current state of the art in the fabrication technologies of structurally reconfigurable metamaterial elements. The micromachined reconfigurable microstructures not only offer a new tuning method for metamaterials without being limited by the nonlinearity of constituent materials, but also enable a new paradigm of reconfigurable metamaterial-based devices with mechanical actuations. With recent development in nanomachining technology, it is possible to develop structurally reconfigurable metamaterials with faster tuning speed, higher density of integration and more flexible choice of the working frequencies.

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“…We suggest to use a special phenomenon encountered in DRIE processes, the Aspect Ratio Dependent Etching (ARDE) (see figure 1) [10,11]. Etching depth is dependent on ‡ Minus sign is used when de-tethering take too much time.…”

Section: Notching Principle For Drie Processmentioning

confidence: 99%

“…To perform high aspect ratio geometry, the DRIE process is commonly used in microfabrication because it allows an accurate control of the notch's depth [9]. We suggest using a special phenomenon encountered in DRIE processes, the aspect ratio dependent etching (ARDE) (see figure 1) [10,11]. Etching depth is dependent on etching width, i.e.…”

Section: Notching Principle For Drie Processmentioning

confidence: 99%

A mechanical de-tethering technique for silicon MEMS etched with a DRIE process

Hériban

Agnus

Petrini

et al. 2009

J. Micromech. Microeng.

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Abstract.Getting Micro-Electro-Mechanical Systems (MEMS) out of a wafer after fabrication processes is of great interest in testing, packaging or simply using these devices. Actual solutions require special machines like wafer dicing machines, increasing time and cost of de-tethering MEMS. This article deals with a new solution for manufacturing mechanical de-tetherable silicon MEMS. The presented solution could be done with DRIE process, already used in silicon MEMS fabrication, without additional time or cost. We are proposing a new way to create a notch on tethers linking both wafer and millimetric MEMS, especially designed to break with a specified mechanical force. A theoretical silicon fracture study, the experimental results and dimensional rules to design the tethers are presented in this article. This new technique is particularly useful for microscopic MEMS parts, and will find applications in the field of the MEMS components micro-assembly. De-tethering MEMS2

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Hole-type two-dimensional photonic crystal fabricated in silicon on insulator wafers

Cited by 7 publications

References 32 publications

Sacrificial bridges for MEMS fabrication

Sacrificial bridges for MEMS fabrication

Micromachined tunable metamaterials: a review

A mechanical de-tethering technique for silicon MEMS etched with a DRIE process

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