“…Fortunately, the research on the AM of Si 3 N 4 ceramic has received more and more attentions recently, and attempts have been on the rise. AM technologies of Si 3 N 4 ceramics mainly include (1) powder bed fusion (including selective laser sintering [SLS], and selective laser melting [SLM], 43–49 and so on), (2) photopolymerization (usually including stereolithography apparatus [SLA], 50 laser‐induced slip [LIS] casting, 51 digital light processing [DLP], 52–65 liquid crystal display [LCD], 66,67 and so on); (3) material extrusion (usually including direct ink writing [DIW] or robocasting, 68–74 fused deposition modeling [FDM], 75–79 and so on); and (4) other AM technologies (including binder jetting [BJ], 80–85 3DP, 86–89 and laminated object manufacturing [LOM] 90–94 ). Schematics of the previous AM technologies for Si 3 N 4 ceramic are illustrated in Figure 2.…”