Hot-compression behaviors of W-50%Cu composite

Abstract

The hot compression behaviors of W-50%Cu composite were investigated at the strain rate range from 0.01 to 5.00 s -1 and the temperature range from 850 to 1000 ºC on Gleeble-1500D hot simulator. The results show that the flow stress during hot compression of W-50%Cu composite is strongly affected by the compression temperature and the strain rate. Moreover, the flow stress decreases with the raising deforming temperature, and increases with the increasing strain rate. The flow stress of the W-50%Cu composite at high temperature can be expressed by Arrhenius model, and the values of structural factor A, stress scale parameter α, stress index n and hot deformation activation Q are 3.18 × 10 9 s -1 , 0.0133 MPa -1 , 6.27393 and 239.442 kJ/mol, respectively.

High-temperature compression behavior of W–10wt.%Cu composite

“…At first, the softening rate was smaller than the work hardening rate, so the flow stress increased rapidly. Afterward, the softening rate became larger until it reached a point where it equaled the work hardening rate, and then the flow stress decreased slowly [6,7].…”

“…Likewise, the plastic deformation techniques such as rolling and swaging have practical significance for various applications. For instance, it is required to use W-Cu composites to produce electronic packaging materials and EDM electrode materials, and filament materials by rolling and swaging [3][4][5][6][7][8][9]. It is important to understand the plastic deformation of W-Cu composite at elevated temperatures.…”

“…It is important to understand the plastic deformation of W-Cu composite at elevated temperatures. However, there is little information reported on the hot deformation behavior of W-Cu composite [6].…”

(Invited) High Pressure Sputtering for High-K Dielectric Deposition. Is It Worth Trying

“…Complex materials can be deposited as long as a composite target can be fabricated, since the sputtering yields of most materials are in the same order of magnitude. Other approaches used to fabricate compounds are co-sputtering (5) and reactive sputtering (4). Finally, the fabrication of nanolaminates is also possible by sequential deposition (6).…”