Au-20Sn (mass fraction) eutectic alloy is a key lead-free solder material for high reliability microelectronics and optoelectronics packaging. The refinement of initial solidification structure can improved the processing performance of Au-20Sn alloy. This paper reported the research progresses on refining solidification structure of Au-20Sn alloy in our research group. The results indicated that the solidification structure of alloy can be effectively refined by rapid solidification with the increasing of cooling rate. The solidification structure can also be refined by incubated nucleation treatment with Au or Sn or by proper melt temperature treatment. The refinement mechanisms of solidification structure by the three types of solidification methods were thoroughly discussed.