2023
DOI: 10.1016/j.cja.2022.07.025
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Hot deformation behavior and strain compensation constitutive model of equiaxed fine grain diffusion-welded micro-duplex TC4 titanium alloy

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Cited by 7 publications
(5 citation statements)
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“…2. The hot flow behavior of the TC4 DB joint has been detailed discussed in previous work [13]. The strain rate sensitivity (m) is a crucial parameter for the construction of hot processing map [14], which can be obtained by fitting the cubic spline relationship between stress (σ) and strain rate (ε • ).…”
Section: Resultsmentioning
confidence: 99%
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“…2. The hot flow behavior of the TC4 DB joint has been detailed discussed in previous work [13]. The strain rate sensitivity (m) is a crucial parameter for the construction of hot processing map [14], which can be obtained by fitting the cubic spline relationship between stress (σ) and strain rate (ε • ).…”
Section: Resultsmentioning
confidence: 99%
“…Wu et al [12] proposed the failure model with calibrated material constants to predict the failure strain of TC4 DB joint at room temperature. Li et al [13] established the Arrhenius-type constitutive model to predict the hot deformation of TC4 DB joint with an AARE value of 10%. On the basis of aforesaid work, the hot processing maps and optimized strain compensation Arrhenius-type constitutive model of TC4 DB joint were developed and discussed in this paper.…”
Section: Introductionmentioning
confidence: 99%
“…The Arrhenius type model parameters β, n 2 , Ψ 3 and ΔQ are determined for diffusion-bonded and heat-treated alloys at the strains of 0.03, 0.04, 0.06, 0.08, 0.1, 0.3, 0.16, 0.18, and 0.2 using the tensile true stress-strain data collected at various deformation strain rates and temperatures. The parameters can be identified using nonlinear regression analysis [11]. The variation of strain can be compensated using higher-order polynomial strain functions obtained from experimental data fitting [38,39].…”
Section: Model Calibrationmentioning
confidence: 99%
“…But still, the bonding interface cannot achieve the same quality as the matrix alloys, and microvoids at the interface cannot be completely eliminated. In previous research, the authors compared the deformation behavior of TC4 alloy with and without the bonding interface at different deformation conditions and noted the significant influence of the bonding defects on the alloy's deformation behavior [11]. These material defects may lead to flow instabilities under some deformation conditions during hot/creep forming [12].…”
Section: Introductionmentioning
confidence: 99%
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