IEEE International Conference on Mechatronics, 2005. ICM '05.
DOI: 10.1109/icmech.2005.1529360
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Hot embossing of micro-featured devices

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Cited by 6 publications
(2 citation statements)
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“…The hot embossing of thermoplastic polymeric materials is a micro-fabrication process that is particularly valuable for the production of microfluidic devices [1][2][3][4]. In hot embossing, a hard, reusable, patterned stamp 4 is pressed into a softened thermoplastic plate, often of thickness ∼1 mm, which is then cooled to freeze its deformation in place before the stamp is removed.…”
Section: Introductionmentioning
confidence: 99%
“…The hot embossing of thermoplastic polymeric materials is a micro-fabrication process that is particularly valuable for the production of microfluidic devices [1][2][3][4]. In hot embossing, a hard, reusable, patterned stamp 4 is pressed into a softened thermoplastic plate, often of thickness ∼1 mm, which is then cooled to freeze its deformation in place before the stamp is removed.…”
Section: Introductionmentioning
confidence: 99%
“…Lithographic methods such as focused beam lithography, UV lithography, and X-ray lithography are relatively slow and expensive, and as a result these methods are suitable for prototyping and small volume production. In contrast, the hot embossing process Jaszewski et al 1998;Moon et al 2005;Chang and Yang 2005;Shan et al 2005;Chen et al 2005;Scheer et al 2004), which has demonstrated 10 nm resolution Scheer et al 2004), is becoming a dominant fabrication method for nano/microstructures when low cost and high throughput are desired.…”
Section: Introductionmentioning
confidence: 89%