Hot Laminated Multilayer Polymer Illumination Structure Based on Embedded LED Chips

Keränen, Kimmo; Mäkinen, Jukka; Heikkinen, Mikko; Hiltunen, Marianne; Koponen, Matti; Lahti, Markku; Sunnari, Antti; Rönkä, Kari

doi:10.1109/tcpmt.2012.2202231

Cited by 9 publications

(6 citation statements)

References 11 publications

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“…In this design, the copper foil acted as substrate, the PET films were hot laminated onto it in a vacuum circumstance. The laminator used in the experiments was lauffer pressen RLKV 25/1 [2]. A schedule of hot lamination process was showed in Fig.4.…”

Section: A the Hot Laminating Processmentioning

confidence: 99%

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A flexible module design with LED chips based on the PET-copper foils

Chen¹,

Jia²,

Yang³

2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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The study focus on the process of metal electroplating on copper substrate to assemble LED chips and molding PET-copper foil to implement a flexible module with LED chips. The process can be divided into two parts,-assembling process and molding process. The LEDs are integrated on copper foil which can deal with the heat dissipation problem effectively. The metal electroplating on copper circuitry can achieve a soldered bonding to LED chips. The flexible layers of polyethylene terephthalate (PET)-copper foil are formed by two approaches -hot lamination and transfer molding. The thickness of PET-copper foil is an important parameter to the thermal design. A finite model is developed to study the effects of heat dissipation at different thickness of PET-copper foils. The results show that the flexible have a good thermal property with the thickness of PET-copper foil from 450um to 650um. Finally, a flexible model is simulated at temperature distribution with 5× 5 LEDs.

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Section: A the Hot Laminating Processmentioning

confidence: 99%

“…The Lamps using the inorganic LED chips to lighting is one of the main trends today and future. Kimmo proposed a hot laminated multilayer polymer illumination structure based on embedded LED chips [2]. D.A.…”

Section: Introductionmentioning

confidence: 99%

A flexible module design with LED chips based on the PET-copper foils

Chen¹,

Jia²,

Yang³

2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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“…However, there are four main problems that are commonly considered as the limiting factors for the OLED commercialization for the next 5-10 years [4], i.e., emissive area, cost, efficiency, and lifetime. Flexible lighting devices can also be made using a multitude of inorganic LEDs divided over the foil surface at a regular spacing [5][6][7][8]. A diffuser can be added to homogenize the light when needed [8].…”

Section: Introductionmentioning

confidence: 99%

“…Flexible lighting devices can also be made using a multitude of inorganic LEDs divided over the foil surface at a regular spacing [5][6][7][8]. A diffuser can be added to homogenize the light when needed [8]. In addition, it is possible to enlarge LED's point source of light-emitting surface using specific collimator optics on top of LED and apply collimator optics output surface with a foil with optical structures diffusing collimated light again [9].…”

Section: Introductionmentioning

confidence: 99%

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Roll-to-roll printed and assembled large area LED lighting element

Keränen

Korhonen

Rekilä

et al. 2015

Int J Adv Manuf Technol

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Novel continuous and mass customizable lightemitting diode (LED) lighting foil system, capable to produce adequate lighting levels for general lighting, was designed, processed, and characterized. Lighting element substrate was processed by roll-to-roll (R2R) printing using silver ink and automatic bonding of LEDs and current regulators on polyethylene terephthalate (PET) substrate using isotropic conductive adhesive (ICA). Demonstrator consisting of two basic lighting elements contained 98 LEDs and produced 860 lm when running with 25 mA operational current through the LEDs when using total electrical driving power of 8.4 W. Measured power conversion efficiency of the demonstrator was 31 % and efficacy 102 lm/W. Element produced 460 lx illumination level measured by an illumination level meter at element's central axis at distance of 1 m. At a distance of 2 m, illumination level was 110 lx, respectively. Temperature measurements with T3Ster thermal characterization instrument showed that when driving LED with maximum nominal driving current of 100 mA, LED junction temperature was about 120°C, when lighting element was in air in room temperature. Accelerated environmental stress tests consisting of 500 cycles from −40 … +80°C in aging oven and 1000 h in +60°C/95 % RH climate chamber were performed to test samples without any failures. In addition, over 700 bending cycles using 20 mm bending radius were performed to test samples without any failures, so bonding of LEDs were shown reliable according to these tests. Achieved results proved that thin, flexible, and large area high luminous flux lighting elements and systems can be processed based on plastic foil manufactured using R2R silver ink printing and R2R automatic bonding of LEDs and regulator components using ICA on that foil.

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