“…Therefore, new gate configurations, such as dual gates that combine bottom and top gates, , tri-gate structures, and the gate-all-around structures, , are designed to enhance the gate modulation ability. These FETs are supposed to be developed into many advanced electronic devices, such as logic units, , memory applications, , photodetectors, − sensors, , and so forth. Nevertheless, in most gate configurations mentioned above, insulators for gates are oxidized substrates, , deposited dielectric layers, or transferred layers, , and only one gate will ultimately appear on one side of the channel.…”