Hybrid in-mould integration for novel electrical and optical features in 3D plastic products

Alajoki, Teemu; Koponen, Matti; Tuomikoski, Markus; Heikkinen, Mikko; Keränen, A.; Keränen, Kimmo; Mäkinen, Jukka; Aikio, Janne; Rönkä, Kari

doi:10.1109/estc.2012.6542129

Cited by 15 publications

(9 citation statements)

References 4 publications

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“…Alajoki et al [75] demonstrated the feasibility of hybrid in-mold integration by fabricating optical touch panels, plastic embedded organic lightemitting diodes (OLED) foils, and disposable healthcare sensors as depicted in figure 13.…”

Section: In-mold Applications and Trendsmentioning

confidence: 99%

The integration of electronic circuits in plastics using injection technologies: a literature review

Bakr¹,

Bossuyt²,

Vanfleteren³

2022

Flex. Print. Electron.

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A great deal of attention has been paid in recent years to the integration of two and three-dimensional integrated electronic parts into plastics, both for their potential applications in modern human lives and for their outstanding properties, which include the ability to reduce product weight and space while increasing product reliability. The development of integrated electronic devices into plastics is advancing rapidly, owing to advancements in methodology and manufacturing techniques, which have significantly raised researcher interest in this topic. In-mold electronics (IME) is a term that describes an injection molding technology that integrates a printed foil with electrical components into a plastic part during the molding process. It is a revolutionary way to form two and three-dimensional products using electronic printed circuits. IME technology is comprised of three fundamental disciplines of study: electronics, materials science, and plastic manufacturing processes. Therefore, this review article aims to summarize the knowledge of these three primary fields to present an overview of in-mold technology. This article covers background history, a description of the In-mold process flow, and summarizes the recent real-life applications. Additionally, this article discusses some of the present technology challenges that must be overcome.

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Section: In-mold Applications and Trendsmentioning

confidence: 99%

The integration of electronic circuits in plastics using injection technologies: a literature review

Bakr¹,

Bossuyt²,

Vanfleteren³

2022

Flex. Print. Electron.

View full text Add to dashboard Cite

show abstract

“…Those HMIs are fabricated as single plastic elements, reducing the weight and manufacturing time while increasing durability. Additionally, the design freedom is strongly increased, and backlighting touch keys and sliders became essential elements [ 2 , 3 , 4 , 5 ]. Usually, this is achieved by placing LEDs next to the areas to be illuminated.…”

Section: Introductionmentioning

confidence: 99%

Influence of Injection Molding Parameters on the Peel Strength between Plasma-Treated Fluoropolymer Films and Polycarbonate

et al. 2023

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Light guiding is used to direct light from an emitting source to a different location. It is frequently realized through a clad–core structure with a difference in the refractive index of the materials. This paper explores the possibility of combining a fluoropolymer (THV) film of low refractive index, serving as a cladding layer, with a polycarbonate (PC) core, via injection molding. Pristine THV lacks adherence to the PC. However, when treated with O2 plasma prior to overmolding, bonding can be established that was quantified in peel tests. The effect of this surface treatment was further investigated by adjusting the plasma treatment duration and time to overmolding. Furthermore, parameter studies comprising the four molding parameters, namely packing pressure, injection speed, melt temperature, and mold temperature, were performed. Numerical injection molding simulations assessed the prevailing temperatures at the PC–THV boundary. Consequently, the temperature–time integral could be calculated and linked with the measured peel strengths by fitting a proportionality constant. While the plasma treatment duration showed minor influence, the activation diminished with time, halving the measured peel loads within 24 h. The adhesion was experimentally found to increase with a lower packing pressure, faster injection speed, and higher melt and mold temperature. Those same molding relations influencing the peel loads were also found with the temperature–time integral when scaled by the proportionality constant in the simulations (R2=85%). Apparently, adhesion is added by molding settings which promote higher interface temperatures that prevail for longer. Hereby, the faster injection speed increases the melt temperature through shear heating. A higher packing pressure, in contrast, presumably increases the heat transfer at the PC–THV interface, accelerating the cooling. The measured peel loads were 0.3–1.6 N/mm for plasma-treated samples and nearly zero for pristine THV.

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“…Many researchers worked intensively to integrate different electrical functionalities like light emitting diodes (LEDs), light guides, numerous touch switches or slides, and near field communication (NFC) antennas into plastic products using the in-mold process [ 3 , 4 ]. By fabricating optical touch panels, organic light emitting diodes (OLEDs), foils, and disposable healthcare sensors, T. Alajoki et al [ 5 ] demonstrated the feasibility of hybrid in-mold integration. O. Rusanen et al [ 6 ] developed the IMSE technology (injection-molded structural electronics) by integrating pre-formed silver-based printed electronics and standard electronics components into 3D plastics.…”

Section: Introductionmentioning

confidence: 99%

A Study on Over-Molded Copper-Based Flexible Electronic Circuits

et al. 2022

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Over-molding has been proposed in recent years as an integrated functional flexible circuit board in a plastic part. This method uses the conventional process for film insert technology. Over-molding has attracted significant attention across many industries due to its potential to deliver different electrical functions in a variety of different part geometries, especially in automotive interiors and home appliances. While it has great application potential, manufacturing challenges continue throughout foil fabrication and injection molding. This raises challenges for designers and researchers responsible for maintaining the reliability of such electronic flexible circuits. Therefore, the purpose of this research paper is to improve some of the over-molding process parameters. On 0805 and 1206 over-molded zero-ohm resistors, electrical, mechanical, and failure characterization was performed. Those components were mounted in parallel, perpendicular, and 45° angled arrangements on two different polymer substrates, polyimide (PI) and polyethylene terephthalate (PET) using lead-free solder, low-melt solder, and conductive adhesive paste. Moreover, as an over-molding material, polycarbonate (PC) with medium viscosity was used. The effect of using different mold shapes (corner mold, 2 mm flat mold, and 3 mm flat mold) and injection molding process parameters (injection speeds and melt temperature) was studied.

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Hybrid in-mould integration for novel electrical and optical features in 3D plastic products

Cited by 15 publications

References 4 publications

The integration of electronic circuits in plastics using injection technologies: a literature review

The integration of electronic circuits in plastics using injection technologies: a literature review

Influence of Injection Molding Parameters on the Peel Strength between Plasma-Treated Fluoropolymer Films and Polycarbonate

A Study on Over-Molded Copper-Based Flexible Electronic Circuits

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