“…Hybrid integration of quantum dots into other material platforms offers a flexible modular approach to building the reconfigurable QPIC, which is promising to exploit the advantage of different material platforms [5–7,203–206,239] . Hybrid integration of quantum-dot emitters into photonic nanostructures on Si [204,240–242] , Si3normalN4 [32,206,243,244] , SiON [227] , GaAs [205] , LiNbO3 [203] , and SiC [243,245] platforms has been demonstrated. Figures 6(e)–6(h) represent some examples of hybrid integration into various material platforms exploiting three commonly used integration technologies: III–V quantum dots embedded in nanowaveguides have been integrated onto LiNbO3 [Fig.…”