Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Billah, Muhammad Rodlin; Blaicher, Matthias; Hoose, T.; Dietrich, Philipp; Marin-Palomo, Pablo; Lindenmann, N.; Nešić, A.; Hofmann, Andreas; Troppenz, U.; Moehrle, Martin G.; Randel, Sebastian; Freude, W.; Koos, C.

doi:10.1364/optica.5.000876

Cited by 206 publications

(125 citation statements)

References 36 publications

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“…Pt , which is coupled to the active region of the device from the horizontally positioned fiber by a photonic wire bond 5,6 , see inset of Fig. S1(a).…”

Section: Lomentioning

confidence: 99%

“…Such links may be efficiently realized by exploiting THz carriers in low-loss atmospheric transmission windows 5 , thereby offering data rates of tens or even hundreds of Gbit/s. To generate the underlying communication signals at the THz transmitter, optoelectronic signal processing [6][7][8][9][10][11] has emerged as a particularly promising approach, leading to demonstrations of wireless transmission at line rates of 100 Gbit/s and beyond [12][13][14][15][16][17][18] . At the THz receiver, however, the advantages of optoelectronic signal processing have not yet been exploited.…”

Section: Introductionmentioning

confidence: 99%

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Wireless THz link with optoelectronic transmitter and receiver

Harter

Ummethala

Blaicher

et al. 2019

Optica

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107

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Photonics might play a key role in future wireless communication systems that operate at THz carrier frequencies. A prime example is the generation of THz data streams by mixing optical signals in high-speed photodetectors. Over the previous years, this concept has enabled a series of wireless transmission experiments at record-high data rates. Reception of THz signals in these experiments, however, still relied on electronic circuits. In this paper, we show that wireless THz receivers can also greatly benefit from optoelectronic signal processing techniques, in particular when carrier frequencies beyond 0.1 THz and wideband tunability over more than an octave is required. Our approach relies on a high-speed photoconductor and a photonic local oscillator for optoelectronic down-conversion of THz data signals to an intermediate frequency band that is easily accessible by conventional microelectronics. By tuning the frequency of the photonic local oscillator, we can cover a wide range of carrier frequencies between 0.03 THz and 0.34 THz. We demonstrate line rates of up to 10 Gbit/s on a single channel and up to 30 Gbit/s on multiple channels over a distance of 58 m. To the best of our knowledge, our experiments represent the first demonstration of a THz transmission link that exploits optoelectronic signal processing techniques both at the transmitter and the receiver. LO LO,a LO,b ff f of two unmodulated c.w. tones acts as photonic local oscillator (T-wave-to-electric conversion, T/E).

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“…Pt , which is coupled to the active region of the device from the horizontally positioned fiber by a photonic wire bond 5,6 , see inset of Fig. S1(a).…”

Section: Lomentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Wireless THz link with optoelectronic transmitter and receiver

Harter

Ummethala

Blaicher

et al. 2019

Optica

Self Cite

107

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“…Our approach is based on 3D-printed freeform polymer structures [24], which we refer to as optical waveguide overpasses (WOP). WOP are realized in situ by two-photon polymerization [25], which has previously been used for fabrication of so-called photonic wire bonds that enable low-loss single-mode connections across chip boundaries [26][27][28][29]. The devices offer low crosstalk of less than -75 dB and allow to bridge series of parallel waveguides, thereby replacing a multitude of WGX.…”

Section: Introductionmentioning

confidence: 99%

Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses

Nešić¹,

Blaicher²,

Hoose³

et al. 2019

Opt. Express

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Complex photonic-integrated circuits (PIC) may have strongly non-planar topologies that require waveguide crossings (WGX) when realized in single-layer integration platforms. The number of WGX increases rapidly with the complexity of the circuit, in particular when it comes to highly interconnected optical switch topologies. Here, we present a concept for WGX-free PIC that relies on 3D-printed freeform waveguide overpasses (WOP). We experimentally demonstrate the viability of our approach using the example of a 4 × 4 switch-and-select (SAS) circuit realized on the silicon photonic platform. We further present a comprehensive graph-theoretical analysis of different n × n SAS circuit topologies. We find that for increasing port counts n of the SAS circuit, the number of WGX increases with n 4 , whereas the number of WOP increases only in proportion to n 2 .

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“…These approaches are challenging as they require compatible substrate materials (such as SiN) and introduce additional fabrication complexity when building electrical gates to QDs, which are essential to control charge noise of the emitter . Modern 3D nanofabrication techniques such as photonic bonding have also been proposed for interfacing photonic circuits and constitute a potentially scalable approach to multi‐chip photonics.…”

Section: Introductionmentioning

confidence: 99%

Suspended Spot‐Size Converters for Scalable Single‐Photon Devices

et al. 2019

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The realization of a highly efficient optical spot‐size converter for the end‐face coupling of single photons from GaAs‐based nanophotonic waveguides with embedded quantum dots is reported. The converter is realized using an inverted taper and an epoxy polymer overlay providing a 1.3 µm output mode field diameter. The collection of single photons from a quantum dot into a lensed fiber with a rate of 5.84 ± 0.01 MHz is demonstrated and a chip‐to‐fiber coupling efficiency of ≈48% is estimated. The stability and compatibility with cryogenic temperatures make the epoxy waveguides a promising material to realize efficient and scalable interconnects between heterogeneous quantum photonic integrated circuits.

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Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Cited by 206 publications

References 36 publications

Wireless THz link with optoelectronic transmitter and receiver

Wireless THz link with optoelectronic transmitter and receiver

Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses

Suspended Spot‐Size Converters for Scalable Single‐Photon Devices

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