Hybrid Material Extrusion Process Optimization for Printability and Adhesion in 3D‐Printed Electronics
Zhao Fu,
Teemu Salo,
Remmi Calvo Guzman
et al.
Abstract:3D printing exhibits strong potential in electronics manufacturing for its quick prototyping and capability of manufacturing complex structures with a wide range of materials. However, thermoplastic polyurethane (TPU) has rarely been fabricated by 3d printing for electronics due to the limited understanding of its printability and the adhesion of the conductors on it. In this research, we investigate the printability of TPU using varying layer height and printing temperature in the Materials Extrusion (MEX) pr… Show more
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