“…Polymers have been considered as a choice for thermal management of electronic devices due to their inherent advantages, such as diverse functionality, lightweight, easy processing, low cost, and excellent environmental stability, [7] but their thermal conductivity is extremely poor, greatly limiting their practical application. It is widely accepted that the addition of highly thermally conductive fillers, such as boron nitride (BN), [8][9][10][11] aluminum oxide (Al 2 O 3 ), [12][13][14] silicon carbide (SiC), [15,16] silver (Ag), [17,18] graphene, [19,20] and carbon nanotubes (CNTs), [21][22][23] can enhance the thermal conductivity of polymer composites. The heat conduction path will be formed after adding a large content of fillers, further improving the thermal conductivity.…”