Hybridization of polyhedral oligomeric silsesquioxane and boron nitride for epoxy composites with improved dielectric, thermal and tensile properties

Zhao, Yongke; Zhou, Manxi; Chen, Guangxin; Zhou, Zheng; Li, Qifang

doi:10.1007/s10854-019-01375-0

Cited by 9 publications

(6 citation statements)

References 36 publications

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“…Which, indicated a PGMA layer was successfully grafted on the surface of the h-BN filler. 17 TEM results showed a thin coating (a PGMA layer) on the h-BN filler surface ( Fig. 3(c) ).…”

Section: Resultsmentioning

confidence: 95%

“…At the same time, graing polymers on the surface of thermal conductive particles have been shown to be an effective method to improve the dispersion of llers and enhance the compatibility between the llers and the polymer matrix, which would lead to an increase in thermal conductivity of composites. 17 The data in Table 1 could be seen that the different lling amounts of llers and the different methods of testing thermal conductivity would affect the thermal conductivity and dielectric properties of composites. The lling amount of functionalized BN ller in the table is the optimal content.…”

Section: Introductionmentioning

confidence: 99%

“…At the same time, grafting polymers on the surface of thermal conductive particles have been shown to be an effective method to improve the dispersion of fillers and enhance the compatibility between the fillers and the polymer matrix, which would lead to an increase in thermal conductivity of composites. 17 …”

Section: Introductionmentioning

confidence: 99%

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Preparation of poly glycidyl methacrylate (PGMA) chain-grafted boron nitride/epoxy composites and their thermal conductivity properties

2021

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“…Which, indicated a PGMA layer was successfully grafted on the surface of the h-BN filler. 17 TEM results showed a thin coating (a PGMA layer) on the h-BN filler surface ( Fig. 3(c) ).…”

Section: Resultsmentioning

confidence: 95%

Section: Introductionmentioning

confidence: 99%

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Preparation of poly glycidyl methacrylate (PGMA) chain-grafted boron nitride/epoxy composites and their thermal conductivity properties

2021

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“…103 Similarly, high-performance epoxy composites were prepared with the chloride salt of octa and BN, and these hybrids were found to have lower dielectric loss values. 104…”

Section: Types Of Boron Nanocompositesmentioning

confidence: 99%

Nanoparticles containing boron and its compounds—synthesis and applications: A review

Tatiya

Pandey

Bhattacharya

2020

Journal of Micromanufacturing

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Nanomaterials have already contributed to many innovative products in the consumer markets. Constant efforts are directed at attaining unique morphologies and reduction in size. Exponential growth in research is thus involved in the synthesis of the novel nanomaterials. Boron and its compounds with distinct functional and structural properties find extensive usage in a variety of fields ranging from nuclear technology to electronics, ceramics, etc. Also, due to their non-toxicity, they are considered an attractive intermediate in the healthcare and cosmetic industry. The majority of reviews on boron and its compounds are focused on morphologies and the structure of the boron compound obtained. Here, we offer a comprehensive review of the unique properties of the major boron compounds: boron carbide (B4C), boron nitride (BN), and heterostructures with metals and organic compounds. In each section, we also describe the subsequent synthesis routes and the challenges associated with them. We have also summarized the various morphologies and shapes reported to be associated with boron and its compounds. In recent years, however, primary research on boron nanoparticle (BNP) has focused on non-toxic/greener and energy-efficient synthesis routes. The usage and production of pure BNPs in the industry are very scarce and are often associated with nanoclusters of boron and other elements. The intricate structural design and low purity of the nanoproducts formed make BNP synthesis challenging. Thus, in the last section, we summarize the challenges and outlook of the current research with future prospects in the area of BNP research.

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“…[23] The reactive group can further increase the reactivity of the POSS with the polymer; the non-reactive group can improve the compatibility of the POSS with the polymer and increase the strength of the composite system. [24,25] Therefore, POSS is a kind of nanomaterial with easy interface modification, good heat resistance, excellent thermal oxidation stability as well as mechanical properties, which make it can be wide applied in aerospace and many high-tech fields. [18,26,27] One of the most attractive applications of POSS is to improvement the heat resistance of polymers since their inorganic Si─O─Si core.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of3,13‐diglycidyloxypropyloctaphenyldouble‐decker polyhedral oligomeric silsesquioxane and the thermal reaction properties with thermosetting phenol‐formaldehyde resin

Niu

Tian

Yan

et al. 2020

J of Applied Polymer Sci

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3,13‐Diglycidyloxypropyloctaphenyl double‐decker silsesquioxane (EP‐DDSQ) was synthesized by process of alkaline hydrolysis condensation of phenyltrimethoxysilane and corner capping reaction of methyldichlorosilane, followed by hydrosilylation with allyl glycidyl ether, and the resultant structure was confirmed by fourier transform infrared spectrometer (FTIR) and nuclear magnetic resonance (NMR), respectively. The thermosetting phenol‐formaldehyde (PF) resin was then modified by EP‐DDSQ, and the reactivity of PF resin with EP‐DDSQ and thermal pyrolysis of modified cured resin were investigated by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The surface morphologies of modified resins at high temperature were characterized with field emission scanning electron microscope (FESEM), and chemical structure of modified resins was analyzed through X‐ray photoelectron spectrometer (XPS). The results showed that the appropriate addition of EP‐DDSQ did not affect the curing temperature of the PF resin itself, but could improve the heat resistance of the system. When the amount of EP‐DDSQ added was 10%, the initial degradation temperature of PF resin was increased by 49.31°C, and when the amount of EP‐DDSQ added was 16%, the char yield of which was reached up to 61.39%, compared with that of pure PF resin (TGA1,000°C of 57.62%) at Ar atmosphere. More importantly, the modified resin formed a regular and dense layer of SiC and SiOx ceramic on the surface after ablation in the muffle furnace at 800°C air atmosphere, which is very important for ablative resistant materials.

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Hybridization of polyhedral oligomeric silsesquioxane and boron nitride for epoxy composites with improved dielectric, thermal and tensile properties

Cited by 9 publications

References 36 publications

Preparation of poly glycidyl methacrylate (PGMA) chain-grafted boron nitride/epoxy composites and their thermal conductivity properties

Preparation of poly glycidyl methacrylate (PGMA) chain-grafted boron nitride/epoxy composites and their thermal conductivity properties

Nanoparticles containing boron and its compounds—synthesis and applications: A review

Synthesis of3,13‐diglycidyloxypropyloctaphenyldouble‐decker polyhedral oligomeric silsesquioxane and the thermal reaction properties with thermosetting phenol‐formaldehyde resin

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