2010
DOI: 10.1007/978-1-4419-5589-0_1
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Hydrogen Co-deposition Effects on the Structure of Electrodeposited Copper

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Cited by 31 publications
(87 citation statements)
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References 57 publications
(141 reference statements)
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“…The method has been tested for the deposition of several porous metals including Sn, 8 Cu, [8][9][10]11,12 Ag and Au…”
mentioning
confidence: 99%
“…The method has been tested for the deposition of several porous metals including Sn, 8 Cu, [8][9][10]11,12 Ag and Au…”
mentioning
confidence: 99%
“…This concept was originally proposed to explain the change in surface morphology during copper electrodeposition in the constant potentiostatic regime at high overpotentials, when, parallel to copper electrodeposition, the vigorous hydrogen evolution occurs [5,13]. According to this concept, when hydrogen evolution is vigorous enough, then electrodeposition process occurs at an overpotential which is effectively lower than the specified one, and this overpotential is denoted as "effective" in a deposition process.…”
Section: Resultsmentioning
confidence: 99%
“…Electrodeposition technique was shown to be very favorable way for the production of this type of electrodes [1,2,4]. Open porous copper electrodes, denoted as both 3-D foam [1,2,4] or honeycomb-like electrodes [5][6][7][8][9][10][11][12][13], are formed by electrodeposition at high current densities and overpotentials, when, parallel to electrodeposition process, the hydrogen evolution reaction occurs. The main characteristics of these electrodes are holes or pores formed upon detachment of hydrogen bubbles, surrounded by the agglomerates of metal grains or dendritic particles.…”
Section: Introductionmentioning
confidence: 99%
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