“…H 2 and D 2 are commonly applied to passivate Si substrates in the microelectronic industry to prevent contamination, such as H 2 O, which is present in the base pressure of standard vacuum vessels. − Additionally, passivation finds various applications in thin film technologies, serving as anticorrosive protection and interface functionalization and creating hard coatings. − Passivation of dangling bonds is crucial in hydrogenated amorphous silicon materials. , Furthermore, the research on the retention of hydrogen and isotopes on the surface holds significant potential for nuclear fusion energy. , Tokamak reactors commonly employ hydrogen and isotopes as fuel sources, and the interaction of these species in the plasma state on the inner walls of the reactor has garnered significant attention in current studies. − Moreover, hydrogen storage assisted by plasma has garnered attention from several research groups. , To control the physical–chemical mechanisms of passivation, factors like the surface state, temperature, and sticking coefficient must be taken into consideration. − …”