Abstract-A carbon nanotube (CNT) growth process on Hf0 2 is reported for the first time for application in nano-sensors, The process uses a combination of Ge nanoparticles and ferric nitrate dispersion and achieves an increase in CNT density from 0.15 to 6.2 11m length/um" compared with the use of ferric nitrate dispersion alone. The growth process is validated by the fabrication of back-gate CNT field-effect transistors (CNTFETs) using AI source/drain (SID) contacts and a "2 anneal at 400°C.The transistors exhibit p-FET behavior with an Iml1offratio of 10 5 and a steep sub-threshold slope of 130 mY/dec. These results are rather sur prising, as earlier research in the literature on CNTFETs with AI SID electrodes showed n-FET behavior. The p-FET behavior is shown to be due to the H 2 anneal, which we ascribe to the smaller electron affinity of hydrogenised CNTs . Measurements of the temperature dependence of the drain current show low Schottky barrier height AI SID contacts after a "2 anneal, which tends to confirm this explanation. Recently, carbon nanotubes (CNTs) are gammg much attention for bio-sensing [1] because they offer the prospect real-time, label-free sensing for point-of-care diagnosis . The main advantage of CNTs for this application is a very high sensitivity due to the large surface to volume ratio of a carbon nanotube. The use of a high-x dielectric as a gate insulator for a CNT field-effect transistor (CNTF ET) is of interest because it delivers improved performance due to an increased l orlloffratio. CNTFETs with a HfD z gate dielectric have also recently been researched for application in high-speed CNT memories and a strong hysteresis effect has been observed [2]. CNTs can be introduced onto HfO z using dispersion techniques, but CNT growth by chemical vapor deposition (CYD) would be more compatible with mainstream silicon technology. However, CYD growth of CNTs on HfD z appears to be very difficult and to our knowledge no work has been reported on this topic to date.In this paper, a CNT growth process on HfO z is reported for the first time and this growth process is used to produce back gate CNTFETs with Al sourceldrain (SID) contacts. The novel growth process uses a combination of Ge nanoparticles and ferric nitrate dispersion to achieve a dramatic increase in CNT yield compared with the use of ferric nitrate dispersion alone. Electrical measurements on completed CNTFETs show p-FET behavior, an excellent l orlloff ratio of 105, and a steep sub-threshold slope of 130 mYIdec.978-1-4 244-4353-6 /09 /$ 25 .00 ©2 0 0 9 IEEE
II. E XPERIMENTALA p" Si substrate (0.005 Q·cm) was employed as a back gate and a passivating SiOz layer was thermally grown, followed by the deposition of a HfO z layer by atomic-layer deposition, as shown in Fig.l . A 30nm SiOz layer was then deposited by plasma enhanced chemical vapor deposition (PECYD) on top of the HfO z and densified at 950°C. The SiOz layer was then implanted with s-ro" em", 20 keY Ge and annealed in N z at 600°C for 40 min to create Ge nanoparticles...