2019
DOI: 10.1007/s00339-019-2470-7
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Hydrophobic Cu2O surfaces prepared by chemical bath deposition method

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Cited by 21 publications
(14 citation statements)
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“…The pore former is added to make the membrane more porous, allowing for higher water flux and solute rejection [39]. The addition of Cu 2 O to the PVDF membrane's outer layer improves the membrane's hydrophilicity [40]. When the membrane's outer layer is hydrophilic, it allows a lot of water to flow into the pore.…”
Section: Resultsmentioning
confidence: 99%
“…The pore former is added to make the membrane more porous, allowing for higher water flux and solute rejection [39]. The addition of Cu 2 O to the PVDF membrane's outer layer improves the membrane's hydrophilicity [40]. When the membrane's outer layer is hydrophilic, it allows a lot of water to flow into the pore.…”
Section: Resultsmentioning
confidence: 99%
“…In fact, It is difficult to detect these changes using the ordinary chemical composition characterization methods (XPS, FTIR, PL and etc.) because the penetration depth of such methods is much larger than the surface layer and the corresponding peaks of copper and different copper oxides (Cu x O) are overlapped ,. This exciting phenomenon, which can solve the challenge of durability of superhydrophobic property of the surfaces in industries, still needs more precisely surveys in theory and practice.…”
Section: Discussionmentioning
confidence: 99%
“…Fabrication of mineral thin films is performed by different coating stimuli such as sol‐gel based methods, chemical and physical vapor deposition, electrodeposition, sputtering and thermal oxidation . Among them, the electrodeposition method has advantages in fabrication of mineral layers on the conductive substrates due to its high efficiency, cost‐effectiveness and quality of deposited layer.…”
Section: Introductionmentioning
confidence: 99%
“…16 Akbari et al reported hydrophobic Cu 2 O surfaces and studied that hydrophobicity was controlled by sintering conditions by lateral migration of copper ions on the surface during thermal processing and related change of the oxygen amount in the copper oxide structure. 17 Chang et al also reported tuning of the wetting behavior of copper oxide systems using thermal annealing. 18 Recently, Lei et hierarchical copper oxide structures and explored them for oil− water separation.…”
Section: ■ Introductionmentioning
confidence: 99%
“…Das et al studied welded network formation of Cu 2 O nanowires and explored its contribution in higher electrical conductivity and water repellency . Akbari et al reported hydrophobic Cu 2 O surfaces and studied that hydrophobicity was controlled by sintering conditions by lateral migration of copper ions on the surface during thermal processing and related change of the oxygen amount in the copper oxide structure . Chang et al also reported tuning of the wetting behavior of copper oxide systems using thermal annealing .…”
Section: Introductionmentioning
confidence: 99%