Hydrophobic Epoxy Caged Silsesquioxane Film (EP-POSS): Synthesis and Performance Characterization

Abstract

Hydrophobic films are widely used in aerospace, military weapons, high-rise building exterior glass, and non-destructive pipeline transportation due to their antifouling and self-cleaning properties. This paper details the successful preparation of hydrophobic epoxy caged sesquioxane (EP-POSS) via two steps of simple organic synthesis, along with studies on the effects of viscosity and reaction time on the reaction. Interestingly, the EP-POSS presented a large contact angle of 125°, indicating its excellent hydrophobicity. The surface micromorphology was observed via FE-SEM (field emission scanning electron microscopy), transmission electron microscopy (TEM), and atomic force microscopy (AFM), and the structural composition and elemental contents were analyzed via X-ray photoelectron spectroscopy (XPS) and energy-dispersive spectrometry (EDS). Thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) tests showed that EP-POSS had excellent thermal properties, and the first degradation reaction occurred at 354 °C. The mechanical performance and abrasion resistance results demonstrated that EP-POSS could be used in solar panels.

UV Curable Robust Durable Hydrophobic Coating Based on Epoxy Polyhedral Oligomeric Silsesquioxanes (EP-POSS) and Their Derivatives

“… 33 In addition, one of the advantages is that POSSs can be designed for UV curing, which could greatly expand its application value. According to previous literature, 34 − 37 Epoxy Polyhedral Oligomeric Silsesquioxanes (EP-POSSs), in Figure 1 below, show an excellent mechanochemical improvement effect on coating materials.…”

Hard Coating Materials Based on Photo-Reactive Silsesquioxane for Flexible Application: Improvement of Flexible and Hardness Properties by High Molecular Weight

“…The high thermal stabilities of EPOSS and EPSQ are due to the high bond dissociation energy of Si–O–Si. In general, the bond dissociation energy of the Si–O bond is 460 kJ/mol, which is high compared to that of C–O (345 kJ/mol) and Si–C (318 kJ/mol) [ 16 , 55 ]. Owing to the high bond dissociation energy, EPOSS and EPSQ composed of Si–O–Si bonds have a high thermal stability.…”