“…Recently, CuO was modified by Au [22], Fe [23], Li [23,24], Na [24], Pd [25], Pt [26], Px (Piroxicam) [27], Ag [28], Cr [28], Sb [28], and Si [28]. Various techniques have been studied to deposit CuO ( Figure 2), for example: magnetron sputtering [22,[28][29][30][31][32], sol-gel [33], thermal oxidation [14,34], hydrothermal techniques [4,5,15,20,21,[35][36][37], hydrothermal techniques with the electrospinning method [38,39], the spray pyrolysis technique [40], the microwave-assisted method [41], electron beam irradiation [42], microplasma synthesis [43], and successive ionic layer adsorption and reaction (SILAR) [44]. In [28], the author presented M-doped CuO-based thin film deposited using magnetron sputtering technology, which is a typical physical vapor deposition (PVD) technique.…”