In recent years, research on hyperdoped semiconductors has accelerated, displaying dopant concentrations far exceedingsolubility limits to surpass the limitations of conventionally doped materials. Nitrogen defects in silicon have been extensivelyinvestigated for their unique characteristics compared to other pnictogen dopants. However, previous practical investigationshave encountered challenges in achieving high nitrogen defect concentrations due to the low solubility and diffusivity ofnitrogen in silicon, and the necessary non-equilibrium techniques, such as ion implantation, resulting in crystal damage andamorphisation. In this study, we present a single-step technique called high-pressure gas immersion excimer laser doping(HP-GIELD) to manufacture nitrogen-hyperdoped silicon. Our approach offers ultrafast processing, scalability, high control, andreproducibility. Employing HP-GIELD, we achieved nitrogen concentrations exceeding 6 at. % (3.01 x 1021 at./cm3) in intrinsicsilicon. Notably, nitrogen concentration remained above the liquid solubility limit to ∼1 μm in depth. HP-GIELD’s high-pressureenvironment effectively suppressed surface damage, while the well-known effects of pulsed laser annealing (PLA) preservedcrystal quality. Additionally, we conducted a theoretical analysis of light-matter interactions and thermal effects governingnitrogen diffusion during HP-GIELD, providing insights into the doping mechanism. Leveraging excimer lasers, our method iswell-suited for integration into high-volume semiconductor manufacturing, particularly front-end-of-line processes.