2022
DOI: 10.1021/acs.nanolett.2c01270
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In Situ Deposition of Skin-Adhesive Liquid Metal Particles with Robust Wear Resistance for Epidermal Electronics

Abstract: Comfort and mechanical stability are vital for epidermal electronics in daily use. In situ deposition of circuitry without the protection of substrates or encapsulation can produce imperceptible, conformal, and permeable epidermal electronics. However, they are easily destroyed by daily wear because the binding force between deposited materials and skin is usually weak. Here, we in situ deposited skin-adhesive liquid metal particles (ALMP) to fabricate epidermal electronics with robust wear resistance. It repr… Show more

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Cited by 61 publications
(63 citation statements)
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“…Strain- and temperature-sensitive soft composites have been extensively developed in recent years because of their broad applications for emerging wearable electronics or flexible robotics. These conductive composites with flexible/stretchable mechanical and electrical properties have attracted great interest due to their high sensitivity and good deformability. , Traditional soft conductive composites usually combine flexible matrix, such as polyurethane (PU) and polydimethylsiloxane (PDMS), , with conductive fillers, such as metallic microparticles, , carbon nanotubes, graphene, etc. In order to achieve highly conductive, sensitive, and flexible features, the soft composites can also be prepared by printing or transferring conductive patterns on a flexible matrix to form conductive laminated structures. , However, there will be a significant compliance mismatch between the rigid conductive fillers and the flexible elastomer matrix, increasing the risk of composite failure and reducing the extensibility, which not only limits the flexibility of composites but also affects the conductivity of flexible sensors under external loadings.…”
Section: Introductionmentioning
confidence: 99%
“…Strain- and temperature-sensitive soft composites have been extensively developed in recent years because of their broad applications for emerging wearable electronics or flexible robotics. These conductive composites with flexible/stretchable mechanical and electrical properties have attracted great interest due to their high sensitivity and good deformability. , Traditional soft conductive composites usually combine flexible matrix, such as polyurethane (PU) and polydimethylsiloxane (PDMS), , with conductive fillers, such as metallic microparticles, , carbon nanotubes, graphene, etc. In order to achieve highly conductive, sensitive, and flexible features, the soft composites can also be prepared by printing or transferring conductive patterns on a flexible matrix to form conductive laminated structures. , However, there will be a significant compliance mismatch between the rigid conductive fillers and the flexible elastomer matrix, increasing the risk of composite failure and reducing the extensibility, which not only limits the flexibility of composites but also affects the conductivity of flexible sensors under external loadings.…”
Section: Introductionmentioning
confidence: 99%
“…A few efforts have been devoted to increasing the mechanical reliability of LM circuits by converting its liquid state into a biphasic (solid−liquid) state through heat treatment, 33,34 the use of pulsed laser lithography to obtain self-packaged structures, 35 or in situ deposition of adhesive LM particles by chemical modification. 36,37 thermally sensitive substrates, or the use of expensive equipment. Thus, it is highly needed to develop a simple and versatile way to create robust LM circuits for reliable use.…”
Section: Introductionmentioning
confidence: 99%
“…For the surface patterning, the liquid nature of LM conductors makes them prone to mechanical damage, requiring additional encapsulation steps to protect the delicate LM circuits. Encapsulated LM cannot directly contact other objects and expose to the environment, limiting their practical use in many important application scenarios such as wearable and implantable electrophysiology monitoring, electrostimulation, and gas and temperature sensing. A few efforts have been devoted to increasing the mechanical reliability of LM circuits by converting its liquid state into a biphasic (solid–liquid) state through heat treatment, , the use of pulsed laser lithography to obtain self-packaged structures, or in situ deposition of adhesive LM particles by chemical modification. , However, these strategies have resulted in multistep operation for pretreatment and patterning of LM, being incompatible with thermally sensitive substrates, or the use of expensive equipment. Thus, it is highly needed to develop a simple and versatile way to create robust LM circuits for reliable use.…”
Section: Introductionmentioning
confidence: 99%
“…Owing to the challenges encountered in the fabrication of LM-based stretchable conductors by direct deposition of bulk LMs on flexible substrates, deposition, and printing of LM micro- and nanodroplet inks are favorable since mechanical or laser-induced sintering of LM droplets can establish conductive paths on the substrates. However, this strategy has several drawbacks, for instance, low conductivity, weak adhesion to substrates, requiring high accuracies of space and force for sintering, and it is only feasible for rather small areas. In some cases, surface modification of LM droplets can be employed to improve the adhesive properties of the LM pattern and even eliminate the mechanical sintering process. …”
Section: Introductionmentioning
confidence: 99%