<i>In Situ</i> Measurement Method for Temperature Profile Optimization During Thermocompression Bonding Process

Jemaa, Salwa Ben; Gagnon, Pascale; Sylvestre, Julien

doi:10.1109/tcpmt.2020.3026927

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

In Situ Measurement Method for Temperature Profile Optimization During Thermocompression Bonding Process

Cited by 3 publications

References 12 publications

Thermo-compression bonding process characteristics and shape control of Cu-pillar microbump joints by optimizing of solder melting

Thermo-compression bonding process characteristics and shape control of Cu-pillar microbump joints by optimizing of solder melting

The Shape Control Process of a Cu/SnAg Solder Joint with a Ni insertion Using Thermo-Compression Bonding

Optimization of Thermocompression Bonding Process for Fine-Pitch Flip-Chip Applications

Contact Info

Product

Resources

About