2006
DOI: 10.1108/09540910610647062
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RLC effects in fine pitch anisotropic conductive film connections

Abstract: Research paper PurposeThe resistance, capacitance and inductance of Anisotropic Conductive Film (ACF) connections determine their high frequency electrical characteristics. The presence of capacitance and inductance in the ACF joint contributes to time delays and crosstalk noise as well as simultaneous switching noise (SSN) within the circuit. The purpose of this paper is to establish an experimental method for estimating the capacitance and inductance of a typical ACF connection. This can help to provide a mo… Show more

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Cited by 6 publications
(4 citation statements)
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“…6(b)]. There appears to be little evidence of this in the literature, however, a recent experimental [33] work has shown signs of behavior resulting from a thin insulating adhesive layer. Also, the electron tunneling effect is nearly linear for low voltages as shown by the left side of the chart in Fig.…”
Section: Resultsmentioning
confidence: 88%
“…6(b)]. There appears to be little evidence of this in the literature, however, a recent experimental [33] work has shown signs of behavior resulting from a thin insulating adhesive layer. Also, the electron tunneling effect is nearly linear for low voltages as shown by the left side of the chart in Fig.…”
Section: Resultsmentioning
confidence: 88%
“…When the resistivity is reduced, we can decrease the heat generated by the electric current to save energy and solve the heat dissipation problem. Moreover, the resistivity is a factor of resistance–capacitance time delay [ 25 ]. The signal delay decreases as the resistance reduces, allowing the components to achieve further efficient performance.…”
Section: Resultsmentioning
confidence: 99%
“…Owing to this specially designed circuit layout, the trace resistances were not included in the measurements, and only the current path constructed by the bump, the trapped conductor particles and the pad contributed to the measured value of the joint resistance. This joint resistance can be divided into five parts as discussed in Dou et al (2003) and Dou et al (2006d), the three already mentioned and the constriction resistances between the conductor particles and the bump/pad.…”
Section: Experimental Methodologymentioning
confidence: 99%