Identification of Multiple Failure Mechanisms for Device Reliability Using Differential Evolution

Chakraborty, Uttara; Bender, Emmanuel; Boning, Duane S.; Thompson, Carl V.

doi:10.1109/tdmr.2023.3328601

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Methods For Separation Of Failure Mechanisms In Packaging As...1

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2024

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Cited by 2 publications

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“…The distributions are deconvolved to reveal the distributions for the separate failure mechanisms using competing risk models, as detailed in the literature [ 91 , 92 ]. U. Chakraborty et al [ 93 ] used differential evolution (DE) and the L-BFGS-B (limited-memory Broyden–Fletcher–Goldfarb–Shanno with the box constraint) method to separate mechanisms based on completing risk models on simulated electromigration and stress voiding data. The results confirm that this approach is highly precise in parameter identification from lifetime data at different temperatures.…”

Section: Methods For Separation Of Failure Mechanisms In Packaging As...mentioning

confidence: 99%

Modern Trends in Microelectronics Packaging Reliability Testing

Bender,

Bernstein,

Boning

2024

Micromachines

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In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes.

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Section: Methods For Separation Of Failure Mechanisms In Packaging As...mentioning

confidence: 99%