Nowadays, full field measurements techniques enable heterogeneous experiments to be performed without the need of averaging assumptions. The richness and the quantity of recording data obtained by these techniques led to the development of robust identification methods, such as the finite element model updating (FEMU) technique. However, it is still difficult to measure both kinematic and thermal full fields at the same location and time since the methods and the devices used to compute them are radically different. Furthermore, it may be complicated to calibrate the temperature measurement system without interfering with the metallurgical state of the sample. The present paper proposes a low-cost procedure that uses the same two CMOS cameras to compute both the 3D-surface kinematic field and the associated thermal field, by stereo-correlation and near infrared thermography, respectively. No interpolation or smoothing operation were finally necessary.