Abstract:Delamination owed to environmental stress is a relevant concern in the field of microelectronics packaging. This study is focused on the adhesion of a photosensitive insulator to inorganic passivation layers and metal caps. Peel testing has been combined with confocal laser scanning microscopy to image the bent shape of the peeled layer in situ. Elastic plastic beam theory and finite element analysis have been used to identify a cohesive traction-separation law matching both the work of separation and the peel… Show more
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