IGBT finite element model for fibre bragg grating sensor installation analysis

Abstract

An IGBT finite element model aimed at facilitating the assessment of Fibre Bragg Grating sensing based direct on-chip temperature monitoring is first presented in this paper. A commercial off-the-shelf IGBT module geometry is characterised, and a thermo-electrical finite element model is then established using its features. The model is subsequently employed to evaluate the local thermal disturbances that may be introduced by the installation of the optical based temperature sensor directly on the top surface of the IGBT chip. The effects of the sensor thermal interface material characteristics, e.g., thermal conductivity and size, in the local temperature environment are investigated.

FBG Head Size Influence on Localized On-Chip Thermal Measurement in IGBT Power Modules

“…3. The thermal FEA model was constructed in COMSOL 5.5 and the geometry of each layer was measured based on cross-sectional analysis of the actual test IGBT power module [19]. COMSOL's 'Heat transfer in solids' and 'Electric Currents' physics are used in the numerical simulation.…”

“…COMSOL's 'Heat transfer in solids' and 'Electric Currents' physics are used in the numerical simulation. [19] provides a detailed description of the model implementation.…”

Junction Temperature Optical Sensing Techniques for Power Switching Semiconductors: A Review

“…State-of-the-art FBG is an optical fiber with an inscribed grating at a particular Bragg wavelength, which reflects light at this designated wavelength. A change in temperature over the grating region, typically associated with power switching semiconductor devices, alters the reflected Bragg wavelength utilized as a monitoring parameter to characterize the thermal behavior of the circuits [ 19 , 20 ].…”

“…State-of-the-art FBG is an optical fiber with an inscribed grating at a particular Bragg wavelength, which reflects light at this designated wavelength. A change in temperature over the grating region, typically associated with power switching semiconductor devices, alters the reflected Bragg wavelength utilized as a monitoring parameter to characterize the thermal behavior of the circuits [19,20]. Unlike the previous reviews that discussed in-depth electrical-based techniques [10,21], this review exclusively concentrates on OBS techniques and comprehensively discusses the three approaches viz.…”