This paper proposes the adoption of the inherent emitter stray inductance LeE in high-power insulated gate bipolar transistor (IGBT) modules as a new dynamic thermo-sensitive electrical parameter (d-TSEP). Furthermore, a family of 14 derived dynamic TSEP candidates has been extracted and classified in voltage-based, time-based and charge-based TSEPs. Accordingly, the perspectives and the implementation challenges of the proposed method are discussed and summarized. Finally, high-power test platforms are designed and adopted to experimentally verify the theoretical analysis. Index Terms-High-power IGBT modules, auxiliary parasitic inductance, dynamic thermo-sensitive electrical parameters, junction temperature extraction principles. I. INTRODUCTION HE fast-growing pace of high-power conversion systems keep developing high-power Insulated Gate Bipolar Transistors (IGBTs) [1,2]. Thermal performance is currently regarded as one of the most important specifications in high-power modules, since both the short-term characteristics [3] and long-term ones are temperature-dependent [4,5]. In terms of the maximum operating junction temperature Tj, the commercially-available silicon-based power devices are rated up to 175 °C and the expected operation Tj in Wide-Band-Gap devices can reach 300 °C [6]. Hence, the knowledge of Tj has a crucial effect on the safe operation area of IGBTs. So far, many practical methods have been proposed [7-10]. Generally, the widely-studied Tj estimation methods in