IGBT lifetime model considering composite failure modes

Li, Lie; He, Yigang; Wang, Lei; Wang, Chuankun; Liu, Xiaoyan

doi:10.1016/j.mssp.2022.106529

Cited by 15 publications

(8 citation statements)

References 16 publications

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“…One common cause of electronics malfunction is the mechanical failure of the die attach layer because of the mismatch in the coefficient of thermal expansion (CTE) between the bonding film and the silicon die (Gharaibeh and Makhlouf, 2020). Such mismatch results in high localization of shear stresses in the die attachment, leading to crack initiation as well as propagation triggering electrical discontinuities (Wang et al , 2023; Li et al , 2022). For this reason, several metallic and nonmetallic die bonds have been developed to ensure high reliability and improved thermal fatigue performance of power electronics (Grieger et al , 2016; Schiffmacher et al , 2020; Kohler and Wilde, 2020).…”

Section: Introductionmentioning

confidence: 99%

A study on the thermomechanical response of various die attach metallic materials of power electronics

Gharaibeh,

Wilde

2024

SSMT

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Purpose In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis. Design/methodology/approach During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined. Findings The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations. Originality/value This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

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Section: Introductionmentioning

confidence: 99%

A study on the thermomechanical response of various die attach metallic materials of power electronics

Gharaibeh,

Wilde

2024

SSMT

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“…The method uses LSSVM to extract nonlinear degradation features and PF to fuse these with linear features, achieving high accuracy with a relative error within 2%. A hybrid approach for real-time monitoring and prediction of IGBT module health was introduced in [26], integrating Convolutional Neural Networks (CNN) and LSTM networks with physical degradation models. The hybrid model achieved high accuracy in RUL predictions using trained real-time data, outperforming traditional methods.…”

Section: Introductionmentioning

confidence: 99%

Optimizing Insulated-Gate Bipolar Transistors’ Lifetime Estimation: A Critical Evaluation of Lifetime Model Adjustments Based on Power Cycling Tests

Alavi,

De Ceuninck,

Daenen

2024

Energies

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This paper presents a detailed refinement and validation of two well-known lifetime prediction models for IGBTs, namely CIPS08 and SKiM63, using experimental power cycling test data. This study focuses on adapting these models to reflect the operational conditions and degradation patterns to more accurately fit different IGBT types and applications. Key modifications include recalibrating the scale factor and temperature coefficients in the SKiM63 model and refining the CIPS08 model coefficients (β1 = −2.910, β2 = 1083.714, β3 = −4.521) based on the impact of temperature fluctuations, bond wire diameter, and electrical stresses observed during power cycling tests. These adjustments provide a significant shift from traditional values, with the recalibrated models offering a better fit, as evidenced by a reasonable coefficient of determination (R2) and root mean square error (RMSE). Utilizing Monte Carlo simulations with a 5% uncertainty, the study calculates the B10 lifetimes of PV inverters, demonstrating a substantial reduction from 43 years in the unmodified model to 13 years in the modified model. This emphasizes the critical need for ongoing modification and validation of predictive models based on the actual operational data to enhance the reliability and efficiency of IGBTs in power electronic systems.

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“…[1][2] As the new generation of semiconductor component, insulated gate bipolar transistor (IGBT) is widely used in high-speed trains, new energy systems with a series of advantages. [3][4][5] Ceramic clad copper has become the first choice of ceramic lining plate in IGBT module packaging. AlN ceramics have gradually attracted the attention of many experts because of its good thermal conductivity and stability.…”

Section: Introductionmentioning

confidence: 99%

“…High power, small volume has gradually become the development trend of electronic components 1–2 . As the new generation of semiconductor component, insulated gate bipolar transistor (IGBT) is widely used in high‐speed trains, new energy systems with a series of advantages 3–5 . Ceramic clad copper has become the first choice of ceramic lining plate in IGBT module packaging.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni foam on the microstructure and properties of AlN ceramic/Cu brazed joint

Guo

Ding

et al. 2023

Int J Applied Ceramic Tech

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Aluminum nitride (AlN) ceramics and oxygen‐free Cu were brazed with multilayer filler consisted of Ag‐Cu‐Ti +Ni foam. The microstructure and forming principle of AlN/Cu joints were studied and the influence of Ni foam on the joints was focused. The result shows that the composition of AlN/Cu joint was AlN/TiN/Ni3Ti+Cu(s,s)+CuTi+Ni foam+Ag(s,s)/Cu. The joint strength was only 66.7 ± 3.7MPa with pure Ag‐Cu‐Ti solder and the fracture occurred inside AlN ceramics due to the residual stress. The foam nickel reacted with Ag‐Cu‐Ti filler metal to form Ni3Ti during brazing process. Ni foam still retained the basic skeleton structure during brazing, and the mechanical capacity of AlN/Cu joint was enhanced significantly. The maximum shear strength of the brazed joint can reach 89.6 ± 4.5 MPa with .1 mm Ni foam, and the fracture position changed to the brazing filler. The result shows that nickel foam can reduce the residual thermal stress, and the mechanical properties of AlN/Cu joints were improved.

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IGBT lifetime model considering composite failure modes

Cited by 15 publications

References 16 publications

A study on the thermomechanical response of various die attach metallic materials of power electronics

A study on the thermomechanical response of various die attach metallic materials of power electronics

Optimizing Insulated-Gate Bipolar Transistors’ Lifetime Estimation: A Critical Evaluation of Lifetime Model Adjustments Based on Power Cycling Tests

Effect of Ni foam on the microstructure and properties of AlN ceramic/Cu brazed joint

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