Image processing of die attach's X-ray images for automatic voids detection and evaluation

Kováč, Ondrej; Girasek, Tomas; Pietriková, Alena

doi:10.1109/isse.2016.7563188

Cited by 11 publications

(6 citation statements)

References 3 publications

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“…X-ray is nowadays the most popular inspection method in development and production of electronics. X-ray is mostly used to detect solder bridges, voids (gas/resin inclusions in the solder joint) and non-wetted solder areas (unsoldered regions due to residues or contamination on component or substrate) [12,13]. However, X-ray is not suited for crack detection [14].…”

Section: A X-ray Inspectionmentioning

confidence: 99%

Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability

Schmid,

Zippelius,

Hanß

et al. 2023

IEEE Trans. Device Mater. Relib.

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Thermo-mechanical reliability is one major challenge in solid-state lighting for automotive applications. Mismatches in the coefficients of thermal expansion (CTE) between high-power LED packages and substrates paired with temperature changes induce mechanical stress. This leads to thermal degradation by crack formation in the solder interconnect and/or delamination in the substrate, which in turn increases junction temperature, thus decreasing light output and reducing the lifetime. A reliability study with a total of 1,800 samples − segmented in nine LED types and five solder pastes − is performed to investigate degradation and understand the influence of solder material and LED package design. The results are presented in two papers. Initial characterization of the LEDs was handled in the first paper. This second paper focuses on degradation and lifetime. Overall, more than 40,000 transient thermal analysis (TTA) and 9,000 scanning acoustic microscopy (SAM) measurements were taken to evaluate degradation during accelerated aging of 1,500 thermal shock cycles. Six different failure modes were observed, which were distinguishable by only using TTA data. For the reliability evaluation, crack ratio was determined by SAM images while thermal degradation as well as mean lifetime were determined using TTA data. Multiple observations were made within this study. First: SAM and TTA data correlated very well; Second: Higher silver content and additives in the solder paste reduce crack growth and increases lifetime; Third: Thick film ceramic LEDs reach significant longer lifetimes than thin film ceramic LEDs, and copper lead-frame LEDs reached by far the longest lifetimes; Fourth: A pad design with a greater pad size, smaller gaps and balanced size ratio between electrical and thermal pad is advantageous; Fifth: Voiding (below 10%) has no significant influence on the reliability.

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Section: A X-ray Inspectionmentioning

confidence: 99%

Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability

Schmid,

Zippelius,

Hanß

et al. 2023

IEEE Trans. Device Mater. Relib.

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show abstract

“…The void ratio (Void area compared to solder interconnect area) was determined by an in-house developed image processing algorithm in MATLAB and is complex compared to even advanced algorithms [26]. The fine internal metallic structures with sharp edges of the LEDs (e.g., top metallization of the submount, wire bonds and gold stud bumps) prevent a simple threshold analysis.…”

Section: A Void Inspectionmentioning

confidence: 99%

Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization

Schmid

Zippelius

Hanß

et al. 2022

IEEE Trans. Device Mater. Relib.

View full text Add to dashboard Cite

Thermo-mechanical reliability is one major issue in solid-state lighting. Mismatches in the coefficients of thermal expansion (CTE) between high-power LED packages and substrates paired with temperature changes induce mechanical stress. This leads to a thermal degradation of LED modules by crack formation in the solder interconnect and/or delamination in the substrate, which in turn increases junction temperature and thus decreases light output and reduces lifetime. To investigate degradation and understand influence of LED package design and solder material, a reliability study with a total of 1800 samples − segmented in nine LED types and five solder pastes − is performed. First of all, in this paper a state-of-the-art review of high-power LED packages is performed by analyzing and categorizing the packaging technologies. Second, the quality inspection after assembly is realized by transient thermal analysis (TTA), scanning acoustic microscopy (SAM) and X-ray. For TTA, a new method is introduced to separate the thermal resistance of the LED package from solder interconnect and substrate by applying the transient dual interface method (TDI) on samples with different solder interconnect void ratios. Further measurement effort is not required. The datasheet values for thermal resistance are verified and the different LED package types are benchmarked. The void ratio of the solder interconnects is determined by X-ray inspection combined with an algorithm to suppress disruptive internal LED package structures. TTA and TDI revealed that initial thermal performance is independent of solder paste type and that voiding is more critical to smaller LED packages. In addition, lower silver proportion in the paste is found to increase voiding. SAM is less sensitive for initial void detection than Xray, but it's applied to monitor crack propagation while aging in combination with TTA. The results of the reliability study, i.e., the crack growth under temperature shock test for the different SAC solders, will be presented in a second independent paper.

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“…X-ray is used to look for die attachment defects by its ability to penetrate the substrate material and detect hidden faults such as voids in die attachment [29], defective solder bumps/joints/balls in a ball greed array [30][31][32][33][34][35][36][37]. In [29], radiographic images were acquired from a semiconductor chip and then image processing methods were employed to automatically compute the amount of epoxy die attachment voids. In [30], a method for automatic detection and location of voids in die attachment solder joints was developed.…”

Section: X-raymentioning

confidence: 99%

“…In [26], the pre-processing stage consisted of two steps of image segmentation for extracting the IC under inspection from a captured image by using a geometric feature vector. Image data acquired via x-ray often use image processing algorithms such as filtering, energy normalization, thresholding, and image enhancement for defect detection as discussed in [29][30][31][32][33][34][35][36][37]. In [38][39][40][41][42][43][44], images of flip chips captured by SAM systems were first segmented based on the flip chip structure using different segmentation techniques.…”

Section: Image Processingmentioning

confidence: 99%

A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

Alam

Kehtarnavaz

2022

IEEE Access

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Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and dependability in an IC. This paper presents a survey or literature review of the methods used for detecting these defects based on different sensing modalities used including optical, radiological, acoustical, and infrared thermography. A discussion of the detection methods used is provided in this survey. Both conventional and deep learning approaches for detecting die attachment and wire bonding defects are considered along with challenges and future research directions.INDEX TERMS die attachment and wire bonding defects, defect detection in IC manufacturing, integrated circuit (IC) defects

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Image processing of die attach's X-ray images for automatic voids detection and evaluation

Cited by 11 publications

References 3 publications

Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability

Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability

Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization

A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

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