Photonic Integrated Circuits (PICs) are chips with optical inputs and outputs that are linked by waveguides. They allow for a better control over the light propagation and an improved mechanical stability with respect to free space optical systems. In this article, a three-dimensional photonic integrated circuit (3D PIC) for hyperspectral imaging is proposed. We will also present our latest numerical and experimental results toward the fabrication of a hyperspectral imaging system using 3D PICs fabricated using an ultrafast femtosecond laser in a glass chip.