Imaging Millimeter Wave Radar with Phased Array Antenna

Körber, Richard; Ziegler, Volker; Schmid, U.

doi:10.1007/978-3-540-77980-3_13

Cited by 10 publications

(3 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Furthermore, this technology offers the possibility to integrate a wide range of passive components into the ceramic body, such as resistors, capacitors and inductors [2]. Hence, due to an ongoing increase in the integration level of electronic devices combined with an ongoing miniaturization, this technology is attractive as advanced substrate material for electronic applications containing a multitude of active and passive devices.…”

Section: Introductionmentioning

confidence: 98%

Investigation on micromachining technologies for the realization of LTCC devices and systems

et al. 2011

View full text Add to dashboard Cite

Low temperature co-fired ceramics (LTCC) has established as a widespread platform for advanced functional ceramic devices in different applications, such as in the space and aviation sector, for micro machined sensors as well as in micro fluidics. This is due to high reliability, excellent physical properties, especially in the high frequency range, and the possibility to integrate passive components in the monolithic LTCC body, offering the potential for a high degree of miniaturisation. However, for further improvement of this technology and for an ongoing increase of the integration level, the realization of miniaturized structures is of utmost importance. Therefore, novel techniques for micro-machining are required providing channel structures and cavities inside the glass-ceramic body, enabling for further application scenarios. Those techniques are punching, laser cutting and embossing. One of the most limitations of LTCC is the poor thermal conductivity. Hence, the possibility to integrate channels enables innovative active cooling approaches using fluidic media for heat critical devices. Doing so, a by far better cooling effect can be achieved than by passive devices as heat spreaders or heat sinks. Furthermore, the realization of mechanic devices as integrated pressure sensors for operation under harsh environmental conditions can be realized by integrating the membrane directly into the ceramic body. Finally, for high power devices substantial improvement can be provided by filling those channel structures with electrical conductive material, so that the resistivity can be decreased drastically without affecting the topography of the ceramics.

show abstract

Section: Introductionmentioning

confidence: 98%

Investigation on micromachining technologies for the realization of LTCC devices and systems

et al. 2011

View full text Add to dashboard Cite

show abstract

“…There is no need of inserting materials foreign to the standard LTCC process such as organic sheets. Thus, additional electrical wiring, thermo-mechanical stress and generally manufacturing costs can be decreased [12,13]. Since a subtractive porosity is fabricated, the process is in need of the selective removal of phases and/or components of the material [9,10].…”

Section: Introductionmentioning

confidence: 99%

Wet chemical porosification of LTCC in phosphoric acid: Celsian forming tapes

Steinhäußer

Hradil

Schwarz

et al. 2015

Journal of the European Ceramic Society

Self Cite

View full text Add to dashboard Cite

“…Therefore, a substrate with areas of transient permittivity is highly preferential for wave guiding and radiating components, since parasitic capacities caused by wiring are reduced to a minimum. Further advantage of such a gradient material is the avoidance of inserting organic materials with their specific temperature related material properties, thus reducing thermo-mechanical stress effects and also manufacturing costs [3][4][5][7][8][9].…”

Section: Introductionmentioning

confidence: 99%