IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling

Yang, Di; Cai, Jian; Wang, Qian; Li, Jingwei; Hu, Yang; Li, Liangliang

doi:10.1007/s10854-014-2489-7

Cited by 23 publications

(8 citation statements)

References 42 publications

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“…The low melting point of Sn2.5Ag0.7Cu0.1RExNi system lead-free solder obviously affects the microstructure and mechanical properties of such solder joints. Microstructure and performance of these joints at the interface area are closely related to the morphology and size of interfacial IMCs and atomic diffusion during those thermal cycles [33,34]. Interface Cu atoms react with interface Sn and Ni atoms to generate Cu 3 Sn, Cu 6 Sn 5 and Ni 3 Sn 4 .…”

Section: Analysis and Discussionmentioning

confidence: 99%

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Cao

Zhang

Shi

et al. 2019

Metals

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The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical and chemical tests. The results show that an intermetallic compound (IMC) layer of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints evolved gradually from the scalloped into larger wavy forms with increasing number of thermal cycles. The roughness and average thickness of IMC increased with thermal-cycle loading. However, at longer thermal-cycle loading, the shear strength of the joints was reduced by about 40%. The fracture pathway of solder joints was initiated in the solder seam with ductile fracture mechanism and propagated to the solder seam/IMC layer with ductile-brittle mixed-type fracture mechanism, when the number of thermal cycles increased from 100 to 500 cycles. By adding 0.05 wt.% Ni, the growth of the joint interface IMC could be controlled, and the roughness and average thickness of the interfacial IMC layer reduced. As a result, the shear strength of joints is higher than those without Ni. When compared to joint without Ni, the roughness and average thickness of 0.05 wt.% Ni solder joint interface IMC layer reached the minimum after 500 thermal cycles. The shear strength of that joint was reduced to a minimum of 36.4% of the initial state, to a value of 18.2 MPa.

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Section: Analysis and Discussionmentioning

confidence: 99%

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Cao

Zhang

Shi

et al. 2019

Metals

View full text Add to dashboard Cite

show abstract

“…The manufacturing difficulties and the reliability problems are generated with the decreasing of solder joint size. These problems are mainly focus on the IMCs in solder joints [6], and the brittle IMCs reduce strength of solder joints and produce Kirkendall voids [7]. The overgrowth of IMCs layer is effectively controlled by adding the appropriate alloying elements, such as Mn [8], Ni [9], Ce [10], Pr [11], Fe [12], Bi [13], Sb [14], In [15], Ag [16], Zn [17] and other nano-scale oxide particles [18,19].…”

Section: Introductionmentioning

confidence: 99%

Investigation of Cu particles size and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu solder joints

Wang²,

Xiong

et al. 2020

Mater. Res. Express

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The effect of Cu particles size and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu solder joint was studied, and the shedding mechanism of intermetallic compounds (IMCs) in the solder joint during transient liquid phase (TLP) bonding process was investigated. The results showed that the microstructure of Cu/In-45Cu/Cu solder joint was composed of Cu 11 In 9 phase, residual In phase and Cu particles, and the microstructure of solder joints prepared by small Cu particles was dense. The content of IMCs was increased with increasing bonding time, and the Cu/In-45Cu/Cu solder joint was composed of Cu 11 In 9 phase and Cu particles under bonding time 30 min. The Cu 2 In phase was formed in the solder joint at 60 min, and many cracks appeared at the interface of Cu 11 In 9 and Cu 2 In phases. The shear strength of Cu/In-45/Cu solder joints with brittle fracture was increased firstly and then decreased with increasing bonding time, and the maximum shear strength of the solder joint was 16.35 MPa at 30 min.

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“…Intermetallic compounds (IMCs) that formed between solders and substrates play an important role in solder joints, because the properties of IMCs are directly related to the performance and reliability of solder joints [1,3,5]. Sn is generally a major component in solders.…”

Section: Introductionmentioning

confidence: 99%

“…Sn is generally a major component in solders. When Sn reacts with Cu that is a conventional under bump metallization (UBM) on substrate, Cu 6 Sn 5 and Cu 3 Sn IMCs form [5][6][7][8][9][10]. Kirkendall voids usually form at the interface between Cu 3 Sn and Cu, which reduce the fracture toughness of solder joints and cause the joint failure [11][12][13]; therefore, a diffusion-barrier layer between Cu and solders is needed to eliminate the formation of IMCs between Cu and Sn.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling

Cited by 23 publications

References 42 publications

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Investigation of Cu particles size and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu solder joints

Microstructure and morphology of interfacial intermetallic compound CoSn3 in Sn–Pb/Co–P solder joints

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